Advanced Interconnect Technologies Qualifies Robust Green --FC-SOIC-- Flip-Chip Small Outline IC Package.Business Editors/High-Tech Writers SINGAPORE--(BUSINESS WIRE)--May 31, 2004 Ready-for-Production Package Offers Superior Reliability and Performance of Flip-Chip Technology with a Green Material Set Advanced Interconnect Technologies (AIT) today announced that it has fully qualified a complete Green Flip-Chip Small Outline IC (FC-SOIC) Narrow Body package that meets today's OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and requirements of MSL1, 260 degrees Celsius. These high-performance packages are the industry's first to use pillar bumping technology from Advanpack Solutions PTE PTE The ISO 4217 currency code for the Portugese Escudo. , Ltd. (APS), with a complete Green package material set solution. With this introduction, AIT is offering customers all of the technical advantages of flip-chip technology plus an industry compliant green package solution in a standard SOIC (Small Outline IC) A small-dimension, plastic, rectangular, surface mount chip package that uses gull-wing pins extending outward. See gull-wing lead, SOJ and chip package. configuration. These new packages are ideal for applications that demand high reliability such as in the automotive and medical fields, as well as RF applications. AIT's green package is in compliance with the European Commission, American Environmental Protection Agency Environmental Protection Agency (EPA), independent agency of the U.S. government, with headquarters in Washington, D.C. It was established in 1970 to reduce and control air and water pollution, noise pollution, and radiation and to ensure the safe handling and and Japan Electronic Industry Development ban on the use of lead, mercury cadmium hexavalent hexavalent having a valence of six. , chromium, PBB PBB: see polybrominated biphenyl. PBDE PBDE Polybrominated Diphenyl Ether PBDE Pentabromodiphenyl Ether (flame retardant additive in plastics) PBDE Parallel Block-Decodable Encoder chemicals. "AIT's FC-SOIC package is an exciting extension to our extensive Flip Chip on Standard Leaded (FCOSL) package technology delivering outstanding performance and reliability," said Mike McKerreghan, chief operations officer, AIT. "With this new offering, AIT is bringing to the industry a robust packaging solution that complies with Europe's green requirements that are expected to be implemented in 2006." The FC-SOIC package has enhanced flip-chip performance and meets the MSL Level 1, 260 degrees Celsius benchmark. It is able to meet all JEDEC The division of the Electronic Industries Alliance (EIA) that deals with semiconductor standards (officially, the JEDEC Solid State Technology Association of EIA). JEDEC was formed in 1958 when the Joint Electron Tube Engineering Council (JETEC) split into two Joint Electron Device requirements after stress testing (Temp Cycle C 1000X, PCT (Private Communications Technology) A protocol from Microsoft that provides secure transactions over the Web. See security protocol. 168 hrs, HTS 150C 1000 hrs.) and presents a solution to the stringent requirements of the Japanese OEM market. AIT's FCOSL packaging provides enhanced electrical characteristics and improved thermal performance by using perimeter or flip-chip pads, which connect the IC to a copper substrate across a shorter path. The packaging does not require any precious metals, and features sealed bond pads, alpha particle protection, and higher temperature tolerance for faster assembly and lower manufacturing costs. This MSL- Level 1 (260 degrees Celsius) robust package can withstand higher processing temperatures, enabling the package to be assembled more quickly. Another benefit of AIT's FCOSL packaging is its ability to maintain pin-to-pin compatibility with existing customer designs. This eliminates the need for modifying the package footprint or the die design, thus significantly saving time and costs. AIT has leveraged its experience with VFQFP-N and WFQFP-N flip-chip package configurations, which are also based on unique pillar bumping, interconnect technology, to offer advanced flip-chip technology on several standard lead frame configurations. FCOSL packages are available in small outline integrated circuits (SOIC), thin shrink small outline package (TSSOP TSSOP Thin Shrink Small Outline Package TSSOP Thin Scale Small Outline Package ), and quad flat package (xQFP) configurations. Pricing and Availability The FC-SOIC packages are manufactured at AIT's factory in Batam, Indonesia, now ready for full production. Pricing is based on volume and configuration. About Advanced Interconnect Technologies (AIT) Advanced Interconnect Technologies is a global provider of semiconductor assembly and test services for many of the world's most successful electronics companies. The company's turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. AIT has received recognition for its field service and product yields from several of the industry's leading semiconductor device manufacturers. The company is also ISO (1) See ISO speed. (2) (International Organization for Standardization, Geneva, Switzerland, www.iso.ch) An organization that sets international standards, founded in 1946. The U.S. member body is ANSI. 9001:2000, ISO 14001 and QS9000 certified. With approximately 3,600 employees worldwide, AIT has factory locations in Batam, Indonesia and Sunnyvale, Calif. The company is headquartered in Singapore. For more information about the company, its products and services please visit their website at www.aithome.com |
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