Advanced Interconnect Technologies Qualifies Laminate-Based System-in-Package Plastic Land Grid Array for Celeritek.Business Editors & High-Tech Writers PLEASANTON, Calif.--(BUSINESS WIRE)--Sept. 18, 2002 Advanced Packaging Solutions Offers Increased Functionality and Improved Reliability Advanced Interconnect Technologies Inc. (AIT) and Celeritek (Nasdaq:CLTK CLTK CLaim ToKen ) today announced the qualification of Celeritek's power amplifier modules (PAMs) in AIT's laminate-based system-in-package (SIP) plastic land grid array The land grid array (LGA) is a type of surface-mount packaging used for integrated circuits. It can be electrically connected to a PCB either by the use of a socket or by soldering directly to the PCB. (PLGA PLGA Poly-Lactic-Co-Glycolic Acid PLGA Plastic Land Grid Array PLGA Physically Limited Golfers Association ). Celeritek's modules incorporate Indium Gallium Phosphide Indium gallium phosphide (InGaP) is a semiconductor composed of indium, gallium and phosphorus. It is used in high-power and high-frequency electronics because of its superior electron velocity with respect to the more common semiconductors silicon and gallium arsenide. (InGaP) Heterojunction Bipolar Transistor The heterojunction bipolar transistor (HBT) is an improvement of the bipolar junction transistor (BJT) that can handle signals of very high frequencies up to several hundred GHz. It is common in modern ultrafast circuits, mostly radio-frequency (RF) systems. (HBT) integrated circuits (ICs) with passive components, and are geared towards cellular applications. As a single package housing multiple ICs, AIT's advanced SIP PLGA technology offers increased functionality and improved reliability. With SIP PLGA technology, Celeritek is able to move to a more cost-effective package, and reduce time-to-market by lowering component count and design complexity. "AIT's qualification of our power amplifier modules in its SIP PLGA enables Celeritek to combine several ICs in a single low-cost package, leveraging a single design over multiple cellular platforms," said Perry Denning, general manager and vice president, Semiconductor Division of Celeritek. "By using this packaging, we are able to offer OEMs a more integrated, low-cost solution. This milestone represents Celeritek's ongoing strategy to provide compact, cost-effective integrated solutions for our power amplifier modules." By combining multiple ICs in a single package, there are fewer steps required by OEMs during the final assembly process, enabling the production of more products with higher yields using fewer assembly lines. "The qualification of Celeritek's modules in our system-in-package PLGA proves that we are able to assist our customers in lowering manufacturing costs and reducing time-to-market with leading-edge technologies," said Ralph Duceour, president and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. of AIT. "AIT is continuing to spearhead the development of system-in-package technologies for mobile, as well as a variety of other applications. AIT's system-in-package is part of an aggressive product development roadmap to further expand our line-up of advanced packaging solutions." AIT's SIP PLGA offers improved electrical performance due to the proximity of the surface mount technology (SMT (1) (Surface Mount Technology) See surface mount. (2) (Station ManagemenT) An FDDI network management protocol that provides direct management. Only one node requires the software. SMT - Station Management ) components to the die. The ICs housed in the SIP PLGA are mounted on specially designed die flags that employ a special PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. thermal via fabrication technology intended to draw heat from the die to the PCB, thus lowering the theta-ja of the die. As the radio-frequency (RF) power amplifier ICs are manufactured using Gallium Arsenide (GaAs) technology and carry high thermal loads of 3.5 to 4 watts (W), AIT has installed state-of-the-art die-attach equipment and thermal die-attach materials/processes to maximize package thermal efficiency. The modular approach of AIT's SIP PLGA offers inherent flexibility from a design standpoint enabling easy re-design versus a more complex system-on-a-chip (SoC) and application specific IC (ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor. ) designs, whereas modifications can be made without changing the board layout. If manufactured utilizing multi-layer and high-density interconnect (HDI) technologies, wiring density inside the package will be increased by two to four times and the I/O count can be reduced by up to 50 percent, further decreasing motherboard complexity and cost, while improving the reliability of the final product. Celeritek designs, manufactures and delivers a broad range of products including handset power amplifiers, driver amplifiers, gain blocks, MMICs, FETs, switches, LNAs, mixers, laser drivers and a variety of integrated products for use in wireless handsets, PDAs, wireless infrastructure, fiber-optic modulator assemblies and personnel communication systems (PCS). Building on engineering expertise and capability in RF design, Celeritek also delivers products for wireless local area networks (WLAN See wireless LAN. WLAN - wireless local area network ) wireless technology. Celeritek is a leader in manufacturing Indium Gallium Phosphide heterojunction bipolar transistors (InGaP HBT). In addition to InGaP HBT, Celeritek excels in the application of GaAs pHEMT, GaAs MESFET See FET. , silicon CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. and integrated passives technology, delivering linear efficient solutions for the converging needs of 3G/4G systems; specializing in CDMA (Code Division Multiple Access) A method for transmitting simultaneous signals over a shared portion of the spectrum. The foremost application of CDMA is the digital cellular phone technology from QUALCOMM that operates in the 800 MHz band and 1.9 GHz PCS band. 1XRTT, CDMA1XEV-DO, CDMA1XEV-DV, WCDMA (Wideband CDMA) A 3G high-speed digital data service provided by cellular carriers that use the TDMA or GSM technology worldwide, including AT&T (formerly Cingular) and T-Mobile in the U.S. , GSM, E-GSM, GPRS, TDMA, EDGE and OFDM multi-carrier air interface standards. About Celeritek Celeritek designs and develops products using MESFET, pHEMT, and HBT GaAs processes tailored to support high capacity broadband wireless and fiber applications. Celeritek is a leading provider of GaAs based RF integrated circuits (RFICs) for use in wireless voice and data applications. The company's products are used worldwide by leading manufacturers of wireless communication systems. For a Data Sheet and additional information contact: Celeritek Marketing, 3236 Scott Boulevard, Santa Clara, CA 95054, Phone: 408/986-5060, Fax: 408/986-5095, Internet: www.celeritek.com About Advanced Interconnect Technologies Advanced Interconnect Technologies is a global provider of semiconductor assembly and test services for the world's most successful electronics companies. The company's turn-key services include design, assembly, testing, failure analysis, and electrical and thermal characterization. AIT has received recognition for its field service and product yields from several of the industry's leading semiconductor device manufacturers. The company is also ISO (1) See ISO speed. (2) (International Organization for Standardization, Geneva, Switzerland, www.iso.ch) An organization that sets international standards, founded in 1946. The U.S. member body is ANSI. 9001:2000, ISO 9002 and ISO 14001 certified. With approximately 4,100 employees worldwide, AIT has factory locations in Hong Kong; Batam, Indonesia; Austin, Texas; Sunnyvale, Calif. and Manteca, Calif. The company has headquarters in Pleasanton. For more information about the company, its products and services visit their Web site at www.aitsales.com. Note to Editors: Reader inquiries publish: salesweb@aitna.com. |
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