Advanced Interconnect Technologies Qualifies Its High Reliability SOIC Packages for Next-Generation Automotive and Power Applications.SINGAPORE -- Provides Industry's First Fully Qualified Hi-Rel Narrow Body SOIC (Small Outline IC) A small-dimension, plastic, rectangular, surface mount chip package that uses gull-wing pins extending outward. See gull-wing lead, SOJ and chip package. Packages with a MSL 1, 260 Degrees C Rating and Zero Delamination delamination /de·lam·i·na·tion/ (de-lam?i-na´shun) separation into layers, as of the blastoderm. de·lam·i·na·tion n. 1. A splitting or separation into layers. 2. Advanced Interconnect Technologies (AIT) today announced the qualification of a new family of High-Reliability (Hi-Rel) narrow body SOIC packages. This qualification allows AIT to provide its customers with zero delamination after MSL 1, 260 degrees C pre-conditioning testing which improves the overall reliability of the end product significantly. This milestone helps AIT's cost conscious customers get unlimited floor life and cost savings on packaging and shipping of units, while ensuring the highest levels of robustness during the critical reliability stress tests. AIT has leveraged industry partnerships to ensure the world's best materials are used in design process in order to attain the highest qualification levels during the reliability testing process. Leading supplier Samsung Techwin helped AIT in the qualification of this package by developing special PPF PPF Plasma protein fraction, see there leadframes with modified surface roughness which adds mechanical bonding and an optimized plating condition. As next-generation developers begin to demand green package solutions with higher reliability ratings, AIT has leveraged its expertise and world-class capabilities to aggressively qualify its solution to better serve the needs in the market place. This availability will allow AIT to capture additional market share with developers of next generation automotive and power sensitive applications. This qualification brings AIT another step closer to achieving the world's most robust SOIC package with a set of bill of materials The list of components that make up a system. For example, a bill of materials for a house would include the cement block, lumber, shingles, doors, windows, plumbing, electric, heating and so on. that are defined as Green and Pb-Free ready. AIT is uniquely positioned in the marketplace to have achieved MSL 1, 260 degrees C with zero delamination. "This industry milestone fully reinforces AIT's mission to provide the market with superior green packaging solutions that offer the highest degree of robustness and reliability," said Mike McKerreghan, chief operating officer Chief Operating Officer (COO) The officer of a firm responsible for day-to-day management, usually the president or an executive vice-president. at AIT. "Working with quality material suppliers such as Samsung Techwin are key factors in the development of packages that meet the ever increasing demands for reliability." About Green Packaging AIT's green package family members are fully compliant with the European Commission, American Environmental Protection Agency Environmental Protection Agency (EPA), independent agency of the U.S. government, with headquarters in Washington, D.C. It was established in 1970 to reduce and control air and water pollution, noise pollution, and radiation and to ensure the safe handling and and Japan Electronic Industry Development ban on the use of lead, mercury cadmium hexavalent hexavalent having a valence of six. , chromium and PBB PBB: see polybrominated biphenyl. PBDE PBDE Polybrominated Diphenyl Ether PBDE Pentabromodiphenyl Ether (flame retardant additive in plastics) PBDE Parallel Block-Decodable Encoder chemicals. In addition, AIT has been awarded the Certificate of Green Partner from a leading global system manufacturer of audio, video and communications systems, which certifies that AIT has successfully established an environmental management system that meets this organization's Green Partner requirements. These requirements include the standard bill of materials (BOM), as well as Master/Intermediate Box, Lock Reel, Cover/Carrier Tape, Aluminum Bag (MBB), Desicant, and Humidity Indicator Card A humidity indicator card (HIC) is a card on which a moisture-sensitive chemical is impregnated such that it will change color when the indicated relative humidity is exceeded. This item is an inexpensive way to quantify relative humidity levels inside sealed packaging. . Pricing and Availability AIT's fully qualified SOIC packages are now available. Pricing is based on volume and configuration. About Advanced Interconnect Technologies (AIT) Advanced Interconnect Technologies is a global provider of semiconductor assembly and test services for many of the world's most successful electronics companies. The company's turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. AIT has received recognition for its field service and product yields from several of the industry's leading semiconductor device manufacturers. The company is also ISO (1) See ISO speed. (2) (International Organization for Standardization, Geneva, Switzerland, www.iso.ch) An organization that sets international standards, founded in 1946. The U.S. member body is ANSI. 9001:2000, ISO 14001 and QS9000 certified. With approximately 3,600 employees worldwide, AIT has factory locations in Batam, Indonesia and Sunnyvale, Calif. The company is headquartered in Singapore. For more information about the company, its products and services please visit their website at www.aithome.com. |
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