Advanced Interconnect Technologies Introduces Stacked Die QFN Package for Next Generation Consumer Applications; New ''System in Package'' Offering Extends AIT's QFN Portfolio With Solution That Delivers Lower Cost and Reduced Foot Print.

SINGAPORE -- Advanced Interconnect Technologies (AIT) today announced the availability of a new stacked die QFN-MCM (multi-chip module) package. The new offering features "System in Package"(SiP) technology that is designed to place 2 or more die in a single package resulting in smaller packages, and thus reducing costs. The "SiP" framework is designed to provide higher levels of integration which decreases the number of needed components and trims the size and routing complexity of the printed circuit board. This stacking technology in a low cost QFN package makes it an ideal solution for space conscious designers of PDA's, camcorders, cell phones and various other portable consumer devices.

AIT's new stacked die QFN-MCM package represents that company's ability to combine new packaging technology with a proven and cost effective material set. The new QFN offering from AIT is green compliant, qualified to MSL 260C and features a package height of just 0.9mm with a minimal die thickness of just 7 mils (measurements are for a 2-die pyramid stacking 1 die side-by-side). This allows for an enormous savings in board space, increases package efficiency in the z-direction, and provides a shorter electrical path which enables the highest levels of reliability.

QFN packages are superior to traditional leaded packages because they do not have gull wing leads which can act as antennas and create "noise" in high frequency applications. In addition, the QFN package also provides better thermal performance because of its exposed leadframe pad, which provides a direct path for removing heat from the package.

"This technology offering is designed to address the needs of designers of next generation consumer applications where board space is at a premium," said Bruno Guilmart, chief executive officer at AIT. "Package offerings such as the stacked die QFN-MCM are part of AIT's natural product evolution to provide the market with a world class technology solution that exceeds the customer's expectations while remaining at a low cost."

AIT's QFN package family are available in a green material set that is fully compliant with the European Commission, U.S. Environmental Protection Agency and Japan's Electronic Industry Development ban on the use of lead, mercury cadmium hexavalent, chromium and PBB PBDE chemicals.

Pricing and Availability

AIT's fully qualified Stacked Die QFN-MCM is available now from AIT's factory in Batam, Indonesia. Pricing is based on volume and configuration.

About Advanced Interconnect Technologies (AIT)

Advanced Interconnect Technologies is a global provider of semiconductor assembly and test services for many of the world's most successful electronics companies. The company's turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. AIT has received recognition for its field service and product yields from several of the industry's leading semiconductor device manufacturers. The company is also ISO 9001:2000, ISO 14001 and QS9000 certified. With approximately 3,600 employees worldwide, AIT has factory locations in Batam, Indonesia, and Sunnyvale, Calif. The company is headquartered in Singapore. For more information about the company, its products and services please visit their website at www.aithome.com.