Advanced Interconnect Technologies Introduces New Ultra-Thin uQFN/DFN Package for Next Generation Consumer Electronics; New Package to Benefit Consumer Electronics Based on Higher Yields and Better Long Term Reliability.

SINGAPORE -- Advanced Interconnect Technologies (AIT) today announced the availability of a new ultra-thin QFN/DFN package. The new offering features a profile of 0.60mm package thickness making it an ideal choice for today's ever shrinking consumer electronics. The lower profile allows for board space reduction, package efficiency in the z-direction, shorter electrical paths for increased power yield and overall system weight reduction.

The new uQFN/DFN package thickness has been reduced directly from the leadframe allowing a larger die thickness. Because the die thickness is not reduced as dramatically, the die will experience less stress and better reliability performance. And since the package will utilize the existing, proven assembly infrastructure, it is expected to have better yield compared to thinner dies.

"The amount of real estate in consumer electronics continues to provide design challenges," said Bruno Guilmart, chief executive officer at AIT. "With AIT's new package technology we can accommodate the needs of smaller and power restricted hand held PDA's, video camera's, smart cards and other devices."

AIT's QFN package family is available in a green material set that is fully compliant with the European Commission, U.S. Environmental Protection Agency and Japan's Electronic Industry Development ban on the use of lead, mercury cadmium hexavalent, chromium and PBB PBDE chemicals.

"This latest package extends our already comprehensive QFN family," said Jean Ramos, AIT's director of package development. "With the new ultra thin QFN, our stacked die QFN-MCM (multi-chip module), which features "System in Package"(SiP) technology and the Green Wirebond QFN (No Leads) and Green FC-QFN (No Leads), we can offer customers exemplary choice and quality for their next generation packaging."

Availability

AIT's fully qualified uQFN/DFN package is available now in full production volumes.

About Advanced Interconnect Technologies (AIT)

Advanced Interconnect Technologies is a global provider of semiconductor assembly and test services for many of the world's most successful electronics companies. The company's turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization. AIT has received recognition for its field service and product yields from several of the industry's leading semiconductor device manufacturers. The company is also ISO 9001:2000, ISO 14001 and ISO/TS16949-2002 certified. With approximately 4,000 employees worldwide, AIT has factory locations in Batam, Indonesia and Sunnyvale, Calif. The company is headquartered in Singapore. For more information about the company, its products and services please visit their website at www.aithome.com.