Advanced Interconnect Technologies Introduces Flip-Chip on Standard Leaded Packaging.

Business Editors/High-Tech Writers

PLEASANTON, Calif.--(BUSINESS WIRE)--April 28, 2003

New Packages Offer the Superior Reliability and Performance of

Flip-Chip Technology in Economical, Standard Leaded Configurations

Extending its leadership in flip-chip technology, Advanced Interconnect Technologies, Inc. (AIT) today announced flip-chip on standard leaded (FCOSL) packages. These high-performance packages are the first in the industry to use pillar bumping technology from Advanpack Solutions PTE, Ltd. (APS), providing better electrical and thermal performance in a smaller footprint than current wire-bond technology.

With this introduction, AIT is offering customers all of the technical advantages of flip-chip technology combined with the cost-effectiveness of standard leaded packages. These new packages are ideal for industries such as wireless and automotive, where performance and compactness are critical considerations.

"AIT's FCOSL technology is an exciting extension of our leaded packaging offering that delivers outstanding value, performance and reliability to customers," said Frank Juskey, manager technical support, AIT. "In the past, flip-chip technology was only available in high-cost array configurations. With FCOSL, AIT is bringing the many benefits of flip-chip packaging to cost-sensitive applications."

AIT has leveraged its experience with VFQFP-N and WFQFP-N flip-chip package configurations, which are also based on unique pillar bumping, interconnect technology, to offer advanced flip-chip technology on several standard lead frame configurations. The new FCOSL packages are available in small outline integrated circuits (SOIC), thin shrink small outline package (TSSOP), single in-line package (SIP) and quad flat package (xQFP) configurations.

AIT's FCOSL packaging provides enhanced electrical characteristics and improved thermal performance by using perimeter or flip-chip pads, which connect the IC to a copper substrate across a shorter path. No precious metals are required, and the packages feature sealed bond pads, alpha particle protection, and higher temperature tolerance for faster assembly and lower manufacturing costs. "Lead-free" versions are also available to meet the requirements for "green technologies." This MSL Level 1 (260 degrees Celsius) robust package is able to withstand higher processing temperatures, enabling the package to be assembled more quickly, which reduces overall manufacturing costs and time-to-market.

Another benefit of AIT's FCOSL packaging is its ability to maintain pin-to-pin compatibility with existing customer designs. This eliminates the need for modifying the package footprint or the die design and provides significant time and cost savings.

Pricing and Availability

AIT is currently qualifying FCOSL packaging with several customers. FCOSL packaging will be manufactured at AIT's factory in Batam, Indonesia, with full production capability available now. Pricing is based on volume and configuration.

About Advanced Interconnect Technologies, Inc. (AIT)

Advanced Interconnect Technologies is a global provider of semiconductor assembly and test services for some of the world's most successful electronics companies. The company's turn-key services include design, assembly, test, failure analysis, and electrical and thermal characterization. AIT has received recognition for its on-time delivery, customer service and product yields from several of the industry's leading semiconductor device manufacturers. With approximately 3,200 employees worldwide, AIT has factory locations in Batam, Indonesia; Austin, Texas; Sunnyvale, Calif.; and Manteca, Calif. The company is headquartered in Pleasanton, Calif. For more information about the company, its products and services, please visit their website at www.aitsales.com.

About Advanpack Solutions PTE Ltd. (APS)

Advanpack Solutions PTE Ltd. (APS) is a Singapore based flip-chip assembly service and technology-licensing provider. The company has filed several patents relating to its unique pillar bumps, No Flow Underfill, assembly processes and different types of packages including Wafer Level-CSP. APS has a full service fab -- which bumps wafers for flip-chip applications. The facility also provides flip-chip assembly services. APS' expertise is in providing advanced flip-chip packaging solutions, which are used in fast growing communications applications such as data networking, broadband and mobile communications, and radio frequency (RF) devices. Further information is available from [e-mail].

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