Advanced Interconnect Technologies Inks Flip-Chip Licensing Agreement With Advanpack Solutions.Business Editors & High-Tech Writers PLEASANTON, Calif.--(BUSINESS WIRE)--Nov. 26, 2001 Agreement Provides AIT With Access Rights to Pillar-Bumping Technology for Small Footprint Applications Advanced Interconnect Technologies (AIT), a global provider of semiconductor assembly and test services, today announced that it has signed a licensing agreement with Advanpack Solutions PTE Ltd PTE LTD Private Limited . (APS), that provides the company with the rights to assemble proprietary pillar-bumped, flip-chip semiconductor packages. Pillar-bumped packages are essential for small footprint semiconductors required in cellular telecommunications (phones and pagers), PCMCIA cards See PC Card. , memory cards, digital cameras and camcorders. This agreement, coupled with AIT's recent licensing of LSI LSI: see integrated circuit. (Large Scale Integration) Between 3,000 and 100,000 transistors on a chip. See SSI, MSI, VLSI and ULSI. Logic's organic flip-chip FPBGA FPBGA Fine Pitch Ball Grid Array technology, reinforces the company's commitment to provide the industry's most advanced flip-chip packaging solutions. "This agreement with APS provides us with access to a low-cost, flip-chip assembly technology that is critical to the development of low- and mid-range lead-frame and array products that have traditionally been served by wire bonding Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The wire is generally made up of one of the following:
"This licensing agreement is a strong addition to our technology portfolio and makes us one of the industry's most advanced technology providers in the high-growth, flip-chip packaging segment." APS' unique pillar-bumping interconnect technology uses perimeter or array flip-chip pads to connect an integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for (IC) to a copper substrate. Pillar-bumped flip-chip packages provide superior electrical and thermal enhancement and a lower profile than available with current wire bond technology. The small size and reduced weight, along with excellent thermal and electrical performance, make the packages an ideal choice for portable and handheld products. "This licensing agreement with AIT will help us spur the migration from wire bond to flip-chip packaging," said Jimmy Chew, chief executive officer of APS. "We have significantly reduced the barriers to entry into the flip-chip market by reducing the cost of the package materials along with the cost of the equipment needed to complete final assembly." The applications for this package range from RF and analog, power devices, memory and communications devices which all benefit from the lower cost structure and small form factor achieved with the APS' flip-chip package solution. APS' package technology offers a "lead free" option for customers who need to meet the demand for "green technologies" today. About Advanpack Solutions PTE PTE The ISO 4217 currency code for the Portugese Escudo. Advanpack Solutions PTE is a Singapore-based flip-chip assembly service and technology-licensing provider. APS has two factories in Singapore: a full service wafer-bumping fab site which bumps wafers for flip-chip applications, as well as a flip-chip assembly factory. APS' principal operations are in Singapore, with global sales operations in the United States United States, officially United States of America, republic (2005 est. pop. 295,734,000), 3,539,227 sq mi (9,166,598 sq km), North America. The United States is the world's third largest country in population and the fourth largest country in area. and Belgium. APS' expertise is in providing advanced flip-chip packaging solutions and wafer level packaging, which are used in fast growing communications applications such as data networking, broadband and mobile communications and radio frequency (RF) devices. Further information is available from sales@qts-aps.com.sg. About Advanced Interconnect Technologies Advanced Interconnect Technologies is a global provider of semiconductor assembly and test services for the world's most successful electronics companies. The company's turnkey services include design, assembly, testing, failure analysis and electrical and thermal characterization. AIT has received recognition for its field service and product yields from several of the industry's leading semiconductor device manufacturers. The company is also ISO (1) See ISO speed. (2) (International Organization for Standardization, Geneva, Switzerland, www.iso.ch) An organization that sets international standards, founded in 1946. The U.S. member body is ANSI. 9001:2000, ISO 9002 and ISO 14001 certified. With approximately 4,800 employees worldwide, AIT has factory locations in Hong Kong Hong Kong (hŏng kŏng), Mandarin Xianggang, special administrative region of China, formerly a British crown colony (2005 est. pop. 6,899,000), land area 422 sq mi (1,092 sq km), adjacent to Guangdong prov. ; Batam, Indonesia; Austin, Texas; Sunnyvale and Manteca, Calif. The company has headquarters in Pleasanton. For more information about the company, its products and services, visit their Web site at www.aitsales.com. Note to Editors: Reader inquiries publish: salesweb@aitna.com. |
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