Advanced Interconnect Technologies Extends Line of Lead-Frame Packages to Include Dual-Sided Products.

Business Editors/High-Tech Writers

PLEASANTON, Calif.--(BUSINESS WIRE)--March 3, 2003

Expanded Family Includes Packages With Two Open Sides to Enable

New Integration Opportunities in Wireless, Portable Computing and

Automotive Designs

Advanced Interconnect Technologies (AIT), a global provider of semiconductor assembly and test services, today announced it has extended its family of lead-frame packages to improve cost and performance while delivering new integration opportunities.

The new Dual Fine Pitch - No Leads (DFN) and enhanced DFN+ packages combine the performance benefits of array packages with the cost efficiency of lead-frame packages. The DFN+ package provides additional value added by allowing integration of passives on two sides of the lead-frame.

Both packages are aimed at products such as cellular phones, portable computers, personal digital assistants (PDAs) and automotive systems that require excellent performance in a small footprint with low manufacturing costs.

"Our basic DFN package is a higher-performance, comparably priced, pin-for-pin replacement for industry-standard small-outline leaded packages such as SOICs, MMCs, xSOPs, TSOPs and TSSOPs," said Frank Juskey, manager technical support with AIT.

"Our DFN+ packages add the benefit of enhanced integration capabilities," Juskey added. "Instead of having to place a package die and dozens of passives on the system board, manufacturers only have to place one or two integrated DFN+ packages, enabling them to increase the productivity of existing manufacturing lines by a factor of five to 10.

"DFN+ packages are ideal for applications such as the radio frequency section of a cellular handset, where there is the requirement to integrate up to two die and three passives while delivering outstanding thermal, electrical and mechanical performance at a lower cost than is possible with laminate-based modules."

Unlike standard leaded packages, AIT's DFN and DFN+ packages eliminate gullwing leads, which can act as noise-creating antennas in high-frequency applications and often cause mechanical defects due to lead coplanarity. The DFN and DFN+ packages also incorporate features that enable them to rival and even exceed the thermal and electrical performance of laminate packages.

Their exposed die-pad provides a direct thermal path for heat removal and their low, .75mm or .90mm mounted profile reduces wire length for faster electrical performance. Additionally, the packages' lead finish and high-contrast black background improve lead alignment for surface mount technology (SMT) placement equipment's optical pattern-recognition systems (PRS).

AIT's DFN and DFN+ packages both use an advanced material set that the company has proven with its very thin fine pitch quad flat packages - no leads (VFQFP-N) and very very fine pitch quad flat packages - no leads (WFQFP-N). They also meet the industry's most stringent moisture sensitivity level (MSL) 1 260 standards and support Japanese requirements for pre-plated lead-frames and lead-free solders.

They are manufactured using matrix array packages (MAP) technology on a fixed lead-frame outline at five times the density of traditional matrix lead frames. A laser-marked identity on each strip enables the auto-line to download process instructions for device laser mark, saw streets and offload for the blinded MAP devices.

Each package is manufactured using the MAP mold blocks on the lead-frame, minimizing the expensive custom tooling typically required for pocket molded packaged devices.

Availability

AIT is in the process of qualifying the new packages with several customers. The DFN and DFN+ packages will be manufactured at AIT's factory in Batam, with production scheduled to begin in the second quarter of 2003.

About Advanced Interconnect Technologies Inc.

Advanced Interconnect Technologies is a global provider of semiconductor assembly and test services for the world's most successful electronics companies.

The company's turn-key services include design, assembly, testing, failure analysis and electrical and thermal characterization. AIT has received recognition for its field service and product yields from several of the industry's leading semiconductor device manufacturers.

The company is also ISO 9001:2000, ISO 9002 and ISO 14001 certified. With approximately 4,000 employees worldwide, AIT has factory locations in Hong Kong; Batam, Indonesia; Austin, Texas; Sunnyvale, Calif.; and Manteca, Calif. The company has headquarters in Pleasanton. For more information about the company, its products and services, visit their Web site at www.aitsales.com.

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