Advanced Electronic Packaging Materials, 2d ed.0471466093 Advanced electronic packaging materials, 2d ed. Ed. by Richard K. Ulrich. IEEE (Institute of Electrical and Electronics Engineers, New York, www.ieee.org) A membership organization that includes engineers, scientists and students in electronics and allied fields. Press 2006 812 pages $125.00 Hardcover IEEE Press series on microelectronic The miniaturization of electronic circuits. See chip. systems TK7870 In this collection of 16 extended articles and monographs, contributors and editors have substantially updated content to keep current with changes in nomenclature nomenclature /no·men·cla·ture/ (no´men-kla?cher) a classified system of names, as of anatomical structures, organisms, etc. binomial nomenclature , materials, practices and technologies since the first edition (date not cited). They address the basics of the functions of an electronic package and the driving forces in technology, then describe materials used in microelectronic packaging. Coverage include properties and analysis of ceramics, polymers, and metals; organic printed circuit board materials and processes; modeling and simulation; thermal and mechanical design considerations; packaging of MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. and MOEMS See MEMS. (including a case study); and reliability, cost evaluation analysis, among other topics. Although intended for graduate-level classroom use (including exercises for each section), this can double as a desk reference. ([c]20062005 Book News, Inc., Portland, OR) |
|
||||||||||||||||
Printer friendly
Cite/link
Email
Feedback
Reader Opinion