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Browse Adams, Tom 1-4 out of 4 article(s) Title Type Date Words Preventing MLCC failures: understanding how mechanical anomalies can cause electrical failure in MLCCs. Aug 1, 2009 1787 Simultaneous acoustic imaging and surface mapping: combining the methods reveals not only the anomaly, but the extent of 3-D distortion. Aug 1, 2008 1217 'Chiplets' create multi-species MCMs: an elegant etching and metallization process for inserting and interconnecting tiny chips. May 1, 2007 819 Optimizing processes and materials for flip chip reliability: careful material selection can yield FC assemblies with better reliabilities than some surface-mount components. Feb 1, 2004 3025

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