Aavid Thermal Technologies, Inc. Announces the Formation of a New Subsidiary, Enductive Solutions, Inc.

Business/Technology Editors

CONCORD, N.H.--(BUSINESS WIRE)--July 11, 2001

Solutions Consulting Firm Provides Highly-Focused, Customized

Computer-Aided Engineering Choices

Aavid Thermal Technologies, Inc., a leading provider of thermal management solutions and developer of computational fluid dynamics software, today announced the launch of its newest subsidiary, Enductive Solutions Inc. (www.enductive.com), with offices in Scotts Valley, California and Concord, New Hampshire. Enductive Solutions helps customers to use computer-aided engineering (CAE) tools in the smartest way possible, thereby shortening their product development cycles, decreasing time-to-market, and reducing costs overall.

Enductive Solutions' approach considers each customer's internal expertise, existing design software, associated databases, hardware, and overall design process. The result is a unique and focused customer-tuned CAE process with a customized graphical user interface (GUI) that ties together all of the design components, specific analysis tools and hardware while saving time, reducing tedium, and achieving integration.

"Desktop analysis and design is no longer an ivory tower tool, reserved for the engineering and scientific elite of large companies and research organizations. It's become a significant competitive advantage," stated Aavid's President and Chief Executive Officer Bart Patel. "The challenge now is not to just pursue CAE, but to deploy and exploit it for design and analysis in any organization. Enductive has the tools to make it happen. We're very excited about this new venture."

Enductive Solutions works with companies to take an objective and in-depth look at their CAE capabilities, considering the organizations' goals, competitive situation, and resources. By partnering with companies, Enductive creates a solution approach that focuses on applicability, integration, simplicity, and ease-of-use.

"Where there is a need for effective use of CAE software, we identify and fulfill that need," said Enductive's Chief Executive Officer Michael Engelman. "Where there is an existing process or tool that works, we preserve it. Where there are CAE integration challenges or opportunities for improved CAE resource management, we guide them toward solutions. We help the engineers by removing the CAE headaches and enabling them to focus on their core competency, namely, product design and analysis"

The firm is led by co-founders Engelman, former President of Fluid Dynamics International, and architect of the computational fluid dynamics (CFD) software FIDAP, and corporate vice-president of CFD software provider Fluent Incorporated; and Philip Raymond, formerly senior director of customer services at Applied Materials and director of engineering analysis at Silicon Graphics Incorporated.

Enductive makes use of a large Solution Alliance Partner network to aid in fast implementation of customer solutions. This network of partners includes the leading CAE software and hardware vendors.

To learn more about the various solution scenarios that Enductive uses as its framework for improving customer's CAE capabilities, visit www.enductive.com or contact Philip Raymond at [e-mail] or 831-338-0404.

Company Background

Aavid Thermal Technologies, Inc. is a leading provider of thermal management solutions for dissipating potentially damaging heat from digital and industrial electronics.

Aavid serves a highly diversified range of markets, principally in North America, Europe and the Far East, driven by the company's operations in three distinct markets: thermal management solutions, computational fluid dynamics software and customized and integrated analysis-design solutions for computer aided engineering (CAE).

Thermal management solutions include products and services that solve problems associated with the dissipation of unwanted heat in electronic and electrical components and systems.

Computational fluid dynamics (CFD) software permits computer modeling and flow analysis of products and processes that would otherwise require time-consuming and expensive physical models and the facilities to test them.

Ongoing increases in silicon and system integration, higher processing speeds and frequencies, smaller form factors, more sophisticated power requirements and other advances in chip technology create excessive heat in microprocessors and IC's (semiconductors) in electronic and electrical components and systems. Microprocessors and integrated circuits operate efficiently only in a narrow temperature band. The excessive heat generated by these semiconductors not only harms their own performance but also degrades system performance and reliability and can cause system failure. The increasingly wide range of environmental conditions, including temperature extremes, in which electronic systems are expected to operate, exacerbates these negative effects. The use of Aavid's thermal solutions helps maintain device and system performance and reliability and helps avoid premature component and system failure.

Beyond specific thermal solutions a variety of design and analysis challenges can be addressed with customized, integrated and tuned analysis-design solutions, These solutions bridge various physical disciplines and their associated CAE software components, resulting in a customer specific solution with an intuitive and specified GUI based interface. This allows the customer to focus on the design challenges at hand not the myriad of analysis and design tools mitigating analysis costs and shortening product design cycles.

Additional information on Aavid Thermal Technologies is available on the World Wide Web at http://www.aatt.com.

"Safe Harbor" Statement Under the Private Securities Litigation Reform Act of 1995

The matters discussed in this release contain forward-looking statements (as such term is defined in the Private Securities Litigation Reform Act of 1995) and information relating to the Company that is based on the beliefs of the management of the Company, as well as assumptions made by and information currently available to the management of the Company. The words "estimate," "project," "believe," "anticipate," "intend," "expect," and similar expressions are intended to identify forward-looking statements. Such statements reflect the current views of the Company with respect to future events, and are subject to risks and uncertainties that could cause actual results to differ materially from those contemplated in such forward-looking statements. The Company does not undertake any obligation to publicly release any revisions to these forward-looking statements to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events.