ASML Introduces the Industry's Highest NA Immersion Tool for Volume Chip Production At 45 nm Node.SAN FRANCISCO San Francisco (săn frănsĭs`kō), city (1990 pop. 723,959), coextensive with San Francisco co., W Calif., on the tip of a peninsula between the Pacific Ocean and San Francisco Bay, which are connected by the strait known as the Golden -- ASML Holding NV (ASML ASML Abstract State Machine Language ASML Anisotropic Shielded Microstrip Line ) today announced a new lithography system with the highest numerical aperture (NA)(a) - 1.2 - in the semiconductor industry. The ASML TWINSCAN(TM) XT:1700i system is a 193 nm immersion scanner capable of volume chip production at the 45 nm node. The new system has a NA that jumped from 0.93 to 1.2, skipping the perceived, pre-immersion barrier of 1.0. The first shipment to a customer, a leading semiconductor manufacturer ordering its second ASML immersion system, will take place in Q1 2006. The XT:1700i allows chip makers to improve resolution by 30 percent, the largest improvement in decades. Better resolution means more chips per wafer or more functionality per chip, thus increasing the value of each wafer. Additionally, the XT:1700i has the highest throughput currently available, 122 wafers per hour, for the 45 nm node. "The XT:1700i is a milestone for the semiconductor industry. The continuation of Moore's Law "The number of transistors and resistors on a chip doubles every 18 months." By Intel co-founder Gordon Moore regarding the pace of semiconductor technology. He made this famous comment in 1965 when there were approximately 60 devices on a chip. depended on either adapting existing or introducing new technology. ASML was able to enhance its fourth-generation immersion systems with a NA that is unchallenged in the market," said Martin van den Brink, executive vice president, marketing and technology, ASML. Additional customer benefits found in the XT:1700i include: --A new catadioptric cat·a·di·op·tric adj. Of or relating to an optical system that uses both reflective and refractive optical devices. catadioptric lens design which combines refractive refractive capacity to refract light. refractive error a difference between the focal length of the cornea and lens, and the length of the eye, resulting in myopia or hyperopia. components with mirrors to create a hyper NA lens that is cost effective to manufacture and a consistent size with other ASML systems. Co-designed with ASML's optics partner, Carl Zeiss SMT (1) (Surface Mount Technology) See surface mount. (2) (Station ManagemenT) An FDDI network management protocol that provides direct management. Only one node requires the software. SMT - Station Management AG, the new lens will also extend to larger NAs in future products; --A maximum field size of 26 by 33 mm, the largest in the industry; --A polarized A one-way direction of a signal or the molecules within a material pointing in one direction. illumination system for improved contrast and exposure latitude at full throughput. With an NA of 1.2, polarization enhances resolution by 5 nm, from 50 to 45 nm; --A fourth-generation, dual-stage immersion tool. All previous generation tools are being used by real customers to produce real chips. --About ASML ASML is the world's leading provider of lithography systems for the semiconductor industry, manufacturing complex machines that are critical to the production of integrated circuits or chips. Headquartered in Veldhoven, the Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ NASDAQ in full National Association of Securities Dealers Automated Quotations U.S. market for over-the-counter securities. Established in 1971 by the National Association of Securities Dealers (NASD), NASDAQ is an automated quotation system that reports on under the symbol ASML. (a)Similar to a camera lens, the numerical aperture - the opening angle of the lens - determines the resolution: the higher the number, the clearer the view. In the case of lithography, higher resolution allows chip makers to draw more refined features onto silicon wafers. For more information on lithography and definitions of technical terms, please see the Lithography Glossary in the "Press" section of ASML.com. |
|
||||||||||||||||

Printer friendly
Cite/link
Email
Feedback
Reader Opinion