ASE to Provide Advanced Packaging Technologies and Test Services for Transmeta's New Crusoe TM5800 Microprocessor.

Business Editors/Technology Writers

SANTA CLARA, Calif.--(BUSINESS WIRE)--June 25, 2001

Transmeta Will Employ ASE's Complete Backend Assembly and

Test Services From Copper Wafer Bumping, Vertical Probe,

Flip Chip Assembly to Final Test

Advanced Semiconductor Engineering, Inc. (NYSE:C), one of the world's largest semiconductor packaging and testing companies, today announced that it has been selected as the backend manufacturing partner for Transmeta Corporation's (Nasdaq:TMTA) new Crusoe TM5800 and TM5500 microprocessors.

ASE, together with subsidiary ASE Test Limited (Nasdaq:ASTSF), will provide Transmeta with complete backend assembly and test services using ASE's leading flip chip assembly and test process, which includes wafer bumping, bumped wafer probing, flip chip assembly, and final test.

Transmeta introduced the new Crusoe microprocessors today at TECHXNY in New York. The new chips, manufactured on 0.13-micron process technology, offer increased performance, consume less power, and allow Transmeta to achieve greater manufacturing economies than their predecessors that were manufactured on 0.18-micron process technology.

The packaging and test process plays a crucial role due to the complexity of the TM5800 and TM5500 chips. To manage the high chip performance demands while conserving energy, the Crusoe microprocessors will be packaged using ASE's leading flip chip ball grid array (BGA). Prior to flip chip packaging, the die is bumped while it is still on the wafer. Bumping is a sophisticated technology requiring a high level of investment in engineering and equipment. ASE currently has the capacity to bump up to 30,000 wafers per month.

"Developing a powerful new generation of Crusoe chips requires strong partners in all stages of the design and manufacturing chain," said David Jensen, vice president of operations, Transmeta Corporation. "ASE proved their capability by delivering seamless service quality on top of their leadership in packaging technology and test services. Transmeta has great confidence in the expertise of ASE."

"The win from Transmeta is a testimonial to ASE's increased recognition as a total solutions provider in backend semiconductor manufacturing services," says Dr. Tien Wu, president of ASE Americas and Europe. "Our customers not only benefit from our advanced packaging technologies but also our full turnkey service flow resulting in a faster cycle time."

For more information on ASE's wafer bumping and flip chip technologies, please visit http://www.aseglobal.com.

About ASE Inc.

ASE Inc. is one of the world's largest independent providers of semiconductor packaging services and, together with its subsidiary ASE Test Limited, one of the world's largest independent providers of semiconductor testing services, including front-end engineering testing, wafer probing and final testing services. The Company's international customer base of more than 200 blue-chip customers includes such leading names as Advanced Micro Devices, Inc., Altera Corporation, Cirrus Logic Inc., Conexant Systems, Inc., LSI Logic Corporation, and Qualcomm Incorporated. With advanced process technology capabilities and a global presence spanning Taiwan, Korea, Hong Kong, Singapore, Malaysia and the United States, ASE Inc. has established a reputation for reliable, high quality products and services. For more information, visit the website, http://www.aseglobal.com.