ASE Ranked Among Business Week's INFO TECH 100 List.SANTA CLARA Santa Clara, city, Cuba Santa Clara (sän`tä klä`rä), city (1994 est. pop. 217,000), capital of Villa Clara prov., central Cuba. , Calif. -- Advanced Semiconductor Engineering Inc. (ASE (Adaptive Server Enterprise) A relational DBMS from Sybase that runs on Windows NT/2000, Linux and a variety of Unix platforms. ASE is a comprehensive and robust data management product with a long history dating back to the late 1980s. ) (TAIEX TAIEX Technical Assistance Information Exchange Office (EU) TAIEX Technical Assistance Information Service : 2311) (NYSE NYSE See: New York Stock Exchange : ASX ASX See: Australian Stock Exchange ), the world's largest semiconductor packaging and testing company, announced today it was ranked among Business Week's INFO TECH 100 List. The only semiconductor assembly and test service provider listed in the top 100, ASE ranked No. 85 on the list, which was published in the June 21 edition of Business Week. The list was based on financial data from Standard & Poors, who evaluated the companies based on four criteria: return on equity, revenue growth, shareholder return and total revenues. In achieving this ranking, much of ASE's success can be attributed to its increasing growth in business areas including the development of advanced IC packaging and testing technologies. The INFO TECH 100 list is an annual list based on 10,000 publicly traded corporations. Featuring many other global market players, ASE is honored to have been ranked alongside some of the most renowned and influential technology companies of the 21st century. To view Business Week's INFO TECH 100 list, please visit http://www.businessweek.com. About ASE Group The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared toward meeting the industry's ever-growing needs for faster, smaller and higher performance chips, the group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done , system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co. Ltd., a member of the ASE Group. The group generated sales revenues of $2.9 billion in 2003 and employs over 29,000 people worldwide. For more information about the ASE Group, visit www.aseglobal.com. |
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