ASAT Holdings to Present at Wit Soundview Semiconductor Conference.Business Editors/High-Tech Writers FREMONT, Calif.--(BUSINESS WIRE)--Aug. 28, 2001 ASAT ASAT abbr. antisatellite Adj. 1. ASAT - of or relating to a system to destroy satellites in orbit; "antisatellite weapons" antisatellite Holdings Limited (Nasdaq:ASTT ASTT Applied Science Technologists and Technicians (Canada) ASTT Advanced Simulation Technology Thrust (DARPA) ASTT Airborne Surveillance and Tracking Technology ASTT Angle Sum Triangle Theorem ), a provider of innovative solutions in integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for (IC) package design, assembly and test, will present at the Wit Soundview Semiconductor Conference in Santa Clara, California Santa Clara, California (IPA: /ˌsæntəˈklærə/) , founded in 1777 and incorporated in 1852, is a city in Santa Clara County, in the U.S. state of California. . A live and archived webcast of the presentation will be available:
Date: Wednesday, August 29, 2001
Time: 12:30 p.m. (PT); 3:30 p.m. (ET) for the live
presentation
Archived: Available 24 hours after the live presentation through
September 12, 2001
Location: On the web at www.asat.com
Media format: RealPlayer or Windows Media
About ASAT Holdings Ltd. ASAT Holdings Limited is a leader in advanced integrated circuit package designs and has provided outsource assembly and test services for the semiconductor industry for over ten years. The company assembles a broad selection of advanced leaded and ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. ) packages utilizing advanced technology characterized by higher electrical and thermal performance. The company also has multi-chip module and flip-chip assembly lines, and offers testing for complex broadband mixed-signal and system-on-a-chip devices used in communications. ASAT is the first packaging company to develop Moisture Sensitive Level One (MSL-1) capability on all leaded products. ASAT has facilities and offices in Asia, Europe, and across the U.S., with major manufacturing facilities in Asia and Europe. ASAT Inc., exclusive distributor of ASAT Ltd.'s services in the United States, is located at 46335 Landing Parkway, Fremont, CA 94538, phone 510/249-1222, fax 510/249-9105. Web site: www.asat.com. |
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