ASAT Holdings Limited Again Extends Deadline for Note Exchange Offer.Business Editors HONG KONG--(BUSINESS WIRE)--Nov. 24, 2000 ASAT ASAT abbr. antisatellite Adj. 1. ASAT - of or relating to a system to destroy satellites in orbit; "antisatellite weapons" antisatellite Holdings Limited has announced the extension of its offer to exchange all outstanding 12.5% senior notes due 2006 for registered 12.5% senior notes due 2006 to 5:00 p.m. EST on December 1, 2000. Since the launch of the exchange offer on October 24, 2000, approximately $82,000,000 or 82% of the aggregate principal amount of 12.5% senior notes outstanding have been deposited with the exchange agent. Noteholders with any questions regarding the exchange offer should contact Carlos Esteves, The Chase Manhattan Bank The Chase Manhattan Bank, now part of JPMorgan Chase, was formed by the merger of the Chase National Bank and the Bank of the Manhattan Company in 1955. The bank is headquartered in New York City. , (212) 638-0828, or Stan Baumgartner, chief financial officer, ASAT Holdings Limited, (852) 2408-7118. ASAT Holdings Limited is a leader in advanced integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for package designs and has provided outsourced assembly and test services for the semiconductor industry for over 10 years. The Company assembles a broad selection of advanced leaded and ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. packages utilizing advanced technology characterized by higher electrical and thermal performance. The Company also has multi-chip module A Multi-Chip Module or MCM is a specialized electronic package where multiple integrated circuits (ICs), semiconductor dies or other modules are packaged in such a way as to facilitate their use as a single IC. and flip-chip assembly lines, and offers testing for complex broadband mixed-signal and system-on-a-chip devices used in communications. The Company has facilities and offices in Asia, Europe, and across the U.S., with its major manufacturing sites strategically located in Hong Kong. |
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