ANADIGICS Announces Internal InGaP HBT Process Capability; World's First 6-inch InGaP HBT Wafer Fab.

WARREN, N.J.--(BUSINESS WIRE)--Oct. 7, 1999--

As part of the Company's continuing effort to develop advanced HBT MMIC (microwave monolithic integrated circuit) products for cellular and PCS handsets, ANADIGICS has successfully demonstrated the fabrication of the first InGaP HBT (indium gallium phosphide heterojunction bipolar transistor) on 6-inch wafers.

The achievement marks the addition of InGaP HBT capability in ANADIGICS' recently-announced 6-inch manufacturing facility, which already offers GaAs MESFET and PHEMT wafer production.

"The development of 6-inch InGaP HBT wafers marks a major milestone in ANADIGICS' HBT development program as well as an outstanding achievement for the semiconductor industry," remarks Jim Gilbert, Vice President of Technology Development at ANADIGICS.

HBT devices have provided millions of high performance power amplifier circuits for cellular and PCS handsets. InGaP HBTs offer outstanding power efficiency and high linearity for power amplifiers, enabling longer battery life and better signal characteristics in wireless devices. In addition, InGaP HBTs also provide high performance characteristics suitable for use in high data rate fiber optic devices.

The InGaP HBT process simplifies the formation of circuits by enabling circuit manufacturers to precisely etch emitter layers and provides a platform to develop more robust, higher performance, and very reliable HBT circuits. Additionally, due to almost ideal band gap compatibility with GaAs, InGaP HBTs exhibit higher current gain and greater temperature stability than traditional AlGaAs (aluminum gallium arsenide) HBTs.

For additional information, contact ANADIGICS by phone [phone] or FAX [phone].

ANADIGICS (NASDAQ: ANAD) designs and manufactures radio frequency integrated circuit (RFIC) solutions for growing broadband and wireless communications markets. The Company's innovative high frequency RFICs enable manufacturers of communications equipment to enhance overall system performance, manufacturing cost, and time to market. By utilizing state-of-the-art manufacturing processes for its RFICs, ANADIGICS achieves the high-volume, and cost-effective products required by leading companies in its targeted high-growth communications markets. ANADIGICS was the first GaAs IC manufacturer to receive ISO 9001 certification. For more information on ANADIGICS, visit the Company's web site at www.anadigics.com

Except for historical information contained herein, this press release contains forward-looking statements that involve risks and uncertainties, including, but not limited to, order rescheduling or cancellation, changes in estimated product lives, timely product and process development, individual product pricing pressure, variation in production yield, difficulties in obtaining components and assembly services needed for production of integrated circuits, change in economic conditions of the various markets the Company and its customers serve, as well as other risks detailed from time to time in the Company's reports filed with the Securities and Exchange Commission, including the report on Form 10-K for the year ended December 31, 1998. Forward-looking statements can generally be identified as such because the context of the statement will include words such as the Company "believes", "anticipates", "expects", or words of similar import. Similarly, statements that describe the Company's future plans, objectives, estimates, or goals are forward-looking statements.