AMT And Hana Announce Merger Of Their IC Assembly And Test Operations.PLEASANTON, Calif.--(BUSINESS WIRE)--Oct. 13, 1999-- Advanced Microtronics Technology (Mauritius) Limited ("AMT See vPro. ") and Hana Microelectronics Public Company Limited ("Hana") signed a definitive agreement today to merge their integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for (IC) assembly and test operations, creating one of the largest IC assembly and test subcontractors in the world with annual sales of approximately US$300 million. In exchange for 43% of the combined entity, Hana will inject into AMT its IC packaging and assembly operations--Hana Technologies Limited ("HTL HTL Hotel HTL Höhere Technische Lehranstalt (Austria) HTL Höhere Technische Lehranstalt (Technical collage) HTL Hearing Threshold Level HTL High Threshold Logic HTL Hole Transport Layer ") based in Hong Kong and AIT International Limited and Advanced Technology Interconnect Inc, both based in the U.S. The combined entity will be renamed upon the consummation of the transaction. The transaction is subject to shareholders approval. Based in Pleasanton, California and Batam Island, Indonesia, AMT, controlled by Newbridge Asia, is one of the world's leading providers of subcontract assembly and test services to the global semiconductor industry. AMT's revenues have grown approximately 30 percent annually over the last three years, driven by a combination of sustained growth in the overall IC market as well as the increasing trend towards outsourcing by semiconductor companies. AMT's production facility in Batam, which is situated approximately 12 miles from Singapore, provides easy access to world class infrastructure and transportation capabilities. "AMT is a high-volume, high-quality, and cost-efficient operation focused on traditional package types and has strong relationships with major IC manufacturers. The partnership with Hana will allow the merged entity to offer a whole range of package types," said Ralph Duceour, the current chief executive officer of AMT who will assume the CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. position of the combined entity, who founded AMT in 1991. "AMT Hana with its combined resources is extremely well-positioned to compete in the marketplace." "Aside from the operational benefits, the merger significantly enhances the strategic positioning of AMT," said Bien Kiat Tan, Managing Director of Newbridge Capital, Southeast Asia. "Hana's operation possesses solid technology fundamentals, including a significant presence in the advanced BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. and CSP (1) (Certified Systems Professional) An earlier award for successful completion of an ICCP examination in systems development. See ICCP. (2) (Commerce Service P packages, which we hope to use as a base for expansion and further growth. Newbridge will continue to be involved in the capacity of providing financial expertise and other strategic guidance" Hana's IC packaging and assembly operation, Hana Technologies Limited ("HTL"), is based in Hong Kong. HTL, one of the world's leading edge advanced IC assembly operations, has a significant presence in the higher-growth segments including Ball Grid Array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (BGA) and Chip Scale Packaging (hardware) Chip Scale Packaging - (CSP) A type of surface mount integrated circuit packaging that provides pre-speed-sorted, pre-tested and pre-packaged die without requiring special testing. An example is Motorola's Micro SMT packaging. (CSP). Hana is listed on the Thailand stock exchange under HANA TB (Bloomberg) or HANA.BK (Reuters). "We continue to be very bullish about the long-term prospects of the semiconductor industry," said Richard Han, Vice Chairman and CEO of Hana. "And in AMT we have found an ideal partner to HTL because of its low cost structure coupled with high service quality and a world-class customer base." Newbridge Asia is a leading private equity firm backed by Texas Pacific Group ("TPG TPG Texas Pacific Group TPG Tapping TPG Transports Publics Genevois (Geneva, Switzerland public transportation) TPG Test Pattern Generator TPG TNT Post Group TPG Trésorier Payeur Général ") and BLUM Capital Partners, L.P., formerly Richard C. Blum
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