AMKOR EXPANDS STACKED CHIP-SCALE PACKAGE CAPACITY AND 3D PACKAGING FAMILY; Reduces cellphone size and weight, increases memory capacity; allows faster time to market.Business Editors/High-Tech Writers CHANDLER, Ariz.--(BUSINESS WIRE)--July 5, 2000 Amkor Technology Amkor Technology, Inc. (NASDAQ: AMKR) is a high-tech semiconductor product manufacturer that includes Intel and IBM among its primary customers. Previously headquartered in West Chester, Pennsylvania, United States, Amkor recently announced that it will move to Chandler, (Nasdaq: AMKR AMKR Amkor Technology ) has expanded its stacked chip scale package A chip scale package (CSP) (sometimes, chip-scale package with a hyphen) is a type of integrated circuit chip carrier. According to the IPC, to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die that is being packaged. (S-CSP S-CSP Stacked Chip-Scale Package ) production capacity to 400,000 units per week as the next step in its comprehensive plan to lead the industry in these advanced technology packages. The company also is increasing its research and development budget for 3D packaging in preparation for the increased broad market demand in cellphones and new portable applications being forecast by leading analysts. A recent study by Prismark Partners, a Cold Spring Harbor, NY market research/technology consulting firm, forecasts S-CSP Flash memory utilization in cellphones to grow from two percent in 1999 to 45 percent in 2003. This increased rate of utilization, coupled with continued growth of cellphone (CELLular telePHONE) The first ubiquitous wireless telephone. Originally analog, all new cellular systems are digital, which has enabled the cellphone to turn into a smartphone that has access to the Internet. production from 258 million units in 1999 to a forecasted 696 million units in 2003, creates a significant demand for S-CSP packages. Amkor developed its S-CSP packaging technology, which combines two or more integrated circuits (ICs) in a stacked die configuration, to help original equipment manufacturers (OEMs) meet consumer demand for devices with more functions, that are thinner, more capable and reliable, and that are lighter weight. These new portable electronic devices include advanced cellular telephones (including the new third generation systems), personal digital assistants (PDAs), handheld personal computers, camcorders and other portable consumer products. Amkor has delivered more than three million stacked chip scale packages to cellphone manufacturers in Japan and Europe since starting production last November. The major mobile phone suppliers were the first to recognize the benefits stacked CSPs deliver, and are planning wider adoption in new model cellphones, according to industry studies. The company expects S-CSP deliveries to grow in the second half of 2000 as new customers begin receiving shipments. "Semiconductor stacking technology offers higher levels of silicon integration without the cost or time-to-market trade-offs associated with system on a chip or embedded memory approaches," said Vince DiCaprio, vice president of advanced application development for Amkor Technology. "Our stacked CSP (1) (Certified Systems Professional) An earlier award for successful completion of an ICCP examination in systems development. See ICCP. (2) (Commerce Service P platform and 3D packaging family provide designers with the flexibility to stack different devices inside industry standard chip scale packages, delivering improved performance and greater cost effectiveness. We accomplish this without sacrificing low mounted height." Stacked CSP packages can include a range of device combinations, including Flash/ SRAM See static RAM. SRAM - static random-access memory , logic/memory, digital signal processors (DSP (1) (Digital Signal Processor) A special-purpose CPU used for digital signal processing applications (see definition #2 below). It provides ultra-fast instruction sequences, such as shift and add, and multiply and add, which are commonly used in math-intensive )/memory, logic/RF and others. Stacking two or more standard devices in a single package can be more cost effective than system on a chip or an embedded memory device. It also makes final installation of the package into its end product faster and less costly for the OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and . To increase the reliability of the package while keeping it as thin as possible, Amkor uses a film adhesive between the top and bottom die. This process reduces the stress that typically occurs between the top and bottom die in the package. The S-CSP uses proven thin-core substrate material, thin ICs and a conventional ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. ) configuration that matches existing surface mount technology and industry test and handling infrastructure. Additionally, a stacked chip configuration permits more circuits and interconnection to exist within the package, which not only reduces the required component mounting area and input/output (I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output. I/O - Input/Output ) on the motherboard, but also improves electrical performance and reliability. Amkor's technology platform also permits a larger variety of ICs and die sizes to be used in the package. Stacked CSP packages have a maximum thickness of 1.4 mm, with 0.5 to 0.8 mm pitch on the I/O solder balls. An 8 mm x 10 mm x 1.4 mm Flash/SRAM package can contain up to 100 I/Os. Logic/Flash, digital/analog and DSP/Flash combination packages can be up to 18 mm on a side and contain over 200 I/Os. This 3D packaging technology also has significant potential for use in Amkor's system in package (SiP) products. About Amkor Technology: Amkor Technology, Inc. is the world's largest provider of contract microelectronics manufacturing solutions. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services, including deep sub-micron wafer fabrication; wafer probe, wafer mapping, characterization and reliability testing; IC packaging design and assembly; multi-chip module design and assembly; and final testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site: www.amkor.com. Forward-Looking Statement forward-looking statement A projected financial statement based on management expectations. A forward-looking statement involves risks with regard to the accuracy of assumptions underlying the projections. : This news release may contain forward-looking statements that involve risk and uncertainty that could cause actual results to differ from anticipated results. Further information on risk factors that could affect the outcome of events set fourth in these statements and that would affect the company's operating results and financial condition is detailed in the company's filing with the Securities and Exchange Commission, including the Report on Form 10-K Form 10-K A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information. Form 10-K See 10-K. for the fiscal year ended December 31, 1999. 2000-20-07-05-00-Amkor Expands Stacked Chi-Scale Package Capacity and 3D Packaging Family |
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