AMD and TI to Collaborate On 3G Wireless Solutions Combining AMD Flash Technology Products and TI's Open Multimedia Application Platform -- OMAP --.Business Editors/High-Tech Writers DALLAS, Texas & SUNNYVALE, Calif.--(BUSINESS WIRE)--Oct. 2, 2000 Stacked System Packaging to Shrink System Size, Enhance Performance and Power Efficiency Designed to set a new standard for system integration and performance, AMD (Advanced Micro Devices, Inc., Sunnyvale, CA, www.amd.com) A major manufacturer of semiconductor devices including x86-compatible CPUs, embedded processors, flash memories, programmable logic devices and networking chips. and Texas Instruments (TI) Inc. today announced their collaboration to develop an advanced architecture for AMD's Flash memory devices and TI's digital signal processors (DSP (1) (Digital Signal Processor) A special-purpose CPU used for digital signal processing applications (see definition #2 below). It provides ultra-fast instruction sequences, such as shift and add, and multiply and add, which are commonly used in math-intensive )-based Open Multimedia Application Platform (OMAP OMAP Office of Medical Assistance Programs (Oregon Department of Human Services) OMAP Open Multimedia Applications Platform (Texas Instruments semiconductor operating system) ). These planned solutions will utilize AMD and TI's advanced process technology, manufacturing, and chip packaging expertise to deliver to wireless appliance developers unprecedented data processing and battery life in an Internet-enabled, next generation (3G) device that can easily fit in the palm of the hand. "Next generation wireless devices will require high speed-interface Flash memory in order to meet increasing computing requirements," said Walid Maghribi, group vice president of AMD's Memory Group. "The collaboration of two industry leaders, TI and AMD, to address the constantly evolving requirements of the wireless market will result in the development of innovative technology standards to enable the proliferation of high performance mobile terminals." "The convergence of communications and broadband-enabled applications like video streaming, Internet audio, and wireless digital photography requires that mobile systems deliver enhanced performance and battery life, while remaining small enough for consumers to use anytime and anywhere," said Gilles Delfassy, vice president, Texas Instruments Worldwide Wireless Communications Unit. "By collaborating with such a leading-edge Flash provider like AMD, TI is exploring yet another new and complementary avenue to deliver the best performing, longest lasting wireless solutions for current and next generation wireless communications devices." By stacking TI's DSP-based OMAP applications processor and AMD's advanced Flash memory devices, customers will have the ability to add new broadband-enabled silicon technology without adding unnecessary bulk to today's mobile appliances. By leveraging TI's advanced Microstar BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. package technology, more than 100 mm2 of previously occupied area will be made available for new 3G technology including TI's advanced Bluetooth and location-based services (GPS) solutions. At the same time, coupling these chips in one package would reduce power consumption between chips up to 30 percent by eliminating the need for off-chip bus architectures. In fact, this also should enable an increase in system performance by reducing the access time required to seek off-chip memory. TI's programmable DSP-based OMAP processing engine delivers the high performance and power efficiency required for communications-centric 2.5 and 3G multimedia applications. OMAP is software compatible with TI's world-leading DSPs, which are used in more the 60 percent of today's digital wireless handsets. The OMAP processor supports all 2G, 2.5G and 3G wireless standards. OMAP is available to OEMs for the development of new applications and has been publicly endorsed by Nokia, Ericsson, and Sony for next generation wireless handsets and advanced mobile computing devices. About AMD Flash Memory Devices AMD technology is employed by the world's largest producer of flash memory devices, Fujitsu AMD Semiconductor Ltd. (FASL FASL Feet Above Sea Level FASL Fujitsu Amd Semiconductor Limited FASL Fellow, Academic Society of London ). AMD flash memory products encompass a broad spectrum of densities and features to support a wide range of markets. AMD offers many flash memory products, such as the award-winning Simultaneous Read-Write (SRW SRW Super Robot Wars (video games) SRW Single Rear Wheel (truck) SRW Segmental Retaining Wall SRW Soldier Radio Waveform SRW Strategic Reconnaissance Wing SRW Search and Retrieve via the Web ) product family; Super Low Voltage 1.8V flash memory devices; and Burst- and Page-Mode devices. AMD developed the robust Known Good Die (KGD KGD Known Good Die (semiconductor industry) KGD Kaliningrad, Russia - Kaliningrad Airport (Airport Code) KGD King's Gambit Declined (chess) KGD Komitee Für Grundrechte Und Demokratie ) program and the patented negative gate erase technology, and refined the industry-standard Fine-pitch Ball Grid Array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (FBGA FBGA Fine-Pitch Ball Grid Array FBGA Fine Pitch Bga FBGA Fine Line Bga ). All AMD flash memory devices are guaranteed for a minimum of one million write cycles per sector and 20 years' data retention, making them the most reliable non-volatile memory devices in the industry. About AMD AMD is a global supplier of integrated circuits for the personal and networked computer and communications markets. AMD produces microprocessors, flash memory devices, and integrated circuits for communications and networking applications. Founded in 1969 and based in Sunnyvale, AMD had revenues of $2.9 billion in 1999. (NYSE NYSE See: New York Stock Exchange :AMD). About TI Texas Instruments Inc. is the world leader in digital signal processing See DSP. Digital Signal Processing - (DSP) Computer manipulation of analog signals (commonly sound or image) which have been converted to digital form (sampled). and analog technologies, the semiconductor engines of the Internet age. The company's businesses also include materials and controls, and educational and productivity solutions. TI is headquartered in Dallas, and has manufacturing or sales operations in more than 25 countries. Texas Instruments is traded on the New York Stock Exchange New York Stock Exchange (NYSE) World's largest marketplace for securities. The exchange began as an informal meeting of 24 men in 1792 on what is now Wall Street in New York City. under the symbol TXN TXN Texas Instruments (stock symbol) TXN Transaction (databases) TXN Tunxi, China (Airport Code) TXN Tarxien (postal locality, Malta) . More information is located on the World Wide Web at: http://www.ti.com Please refer all reader inquiries to: Texas Instruments Inc. Semiconductor Group, SC-00136 Literature Response Center P.O. Box 954 Santa Clara, CA 91380 800/477-8924, ext. 4500 |
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