Printer Friendly
The Free Library
19,573,962 articles and books
Member login
User name  
Password 
 
Join us Forgot password?

AMD and LSI Logic Partner to Develop Solutions for Wireless Handsets.


Business Editors/High Tech Writers

SILICON VALLEY, Calif.--(BUSINESS WIRE)--Oct. 23, 2000

Combining AMD's Flash Memory Devices and LSI's Baseband Technology The introduction to this article provides insufficient context for those unfamiliar with the subject matter.
Please help [ improve the introduction] to meet Wikipedia's layout standards. You can discuss the issue on the talk page.
 

to Boost Performance and Lower Power Consumption

LSI LSI: see integrated circuit.


(Large Scale Integration) Between 3,000 and 100,000 transistors on a chip. See SSI, MSI, VLSI and ULSI.
 Logic Corporation (NYSE NYSE

See: New York Stock Exchange
:LSI) and Advanced Micro Devices, Inc. (NYSE: AMD (Advanced Micro Devices, Inc., Sunnyvale, CA, www.amd.com) A major manufacturer of semiconductor devices including x86-compatible CPUs, embedded processors, flash memories, programmable logic devices and networking chips. ) today announced their agreement to develop advanced solutions for the fast-growing wireless handset market. According to according to
prep.
1. As stated or indicated by; on the authority of: according to historians.

2. In keeping with: according to instructions.

3.
 Dataquest, 68 million Code Division Multiple Access (CDMA (Code Division Multiple Access) A method for transmitting simultaneous signals over a shared portion of the spectrum. The foremost application of CDMA is the digital cellular phone technology from QUALCOMM that operates in the 800 MHz band and 1.9 GHz PCS band. ) handsets are anticipated to be sold this year, increasing to an estimated 264 million units by 2003.

Under the terms of the agreement, AMD and LSI Logic will collaborate to develop optimal interfaces between baseband processors and flash memory devices for the CDMA marketplace. The companies will also collaborate on developing multi-chip package (MCP (1) See Microsoft certification.

(2) (MultiChip Package) A chip package that contains two or more chips. It is essentially a multichip module (MCM) that uses a laminated, printed-circuit-board-like substrate (MCM-L) rather than ceramic (MCM-C).
) solutions to house the baseband processor and flash memory product. This "system-in-a-package" solution will be designed to significantly improve performance, reduce form factor and lower power consumption.

"This collaboration is designed to use AMD's high performance flash memory technology to unlock the processing power of LSI Logic's innovative CDMA baseband processor," said Walid Maghribi, group vice president of AMD's Memory Group. "Next-generation mobile terminals will require an optimized interface between the Flash memory and the baseband processor to harness wireless broadband capabilities."

"By leveraging AMD's leadership position in flash memory technology, LSI Logic is taking a pivotal step forward to better serve customers in this explosive market," said John Daane, executive vice president of LSI Logic's Communications Products Group. "Our thrust into the wireless market is consistent with LSI Logic's strategy of targeting the rapidly growing global communications arena."

Daane noted that the combination of AMD's advanced Flash memory technology with LSI Logic's next generation CDMA solution will enhance current product offerings for the wireless market, and the technologies and capabilities developed as a part of this partnership may be applicable to other markets as well.

"The potential results of this agreement are significant," added Maghribi. "Our customers will have the performance required to deliver a broad range of products with video streaming, Internet audio and other advanced applications resulting in a wider range of choices for the consumer."

"LSI Logic's corporate strategy calls for the company to successfully compete and gain market share in fast-moving global communications markets," said Daane. "Enhancing our customer offerings in the accelerating CDMA handset market is a reflection of LSI Logic's plan to rapidly grow revenues in these markets."

About AMD Flash Memory Devices

AMD technology is employed by the world's largest producer of flash memory devices, Fujitsu AMD Semiconductor Ltd. (FASL FASL Feet Above Sea Level
FASL Fujitsu Amd Semiconductor Limited
FASL Fellow, Academic Society of London
). AMD flash memory products encompass a broad spectrum of densities and features to support a wide range of markets. AMD offers many flash memory products, such as the award-winning Simultaneous Read-Write (SRW SRW Super Robot Wars (video games)
SRW Single Rear Wheel (truck)
SRW Segmental Retaining Wall
SRW Soldier Radio Waveform
SRW Strategic Reconnaissance Wing
SRW Search and Retrieve via the Web
) product family; Super Low Voltage 1.8V Flash memory devices; and Burst- and Page-Mode devices. AMD developed the robust Known Good Die (KGD KGD Known Good Die (semiconductor industry)
KGD Kaliningrad, Russia - Kaliningrad Airport (Airport Code)
KGD King's Gambit Declined (chess)
KGD Komitee Für Grundrechte Und Demokratie
) program and the patented negative gate erase technology, and refined the industry-standard Fine-pitch Ball Grid Array “BGA” redirects here. For other uses, see BGA (disambiguation).

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits.
 (FBGA FBGA Fine-Pitch Ball Grid Array
FBGA Fine Pitch Bga
FBGA Fine Line Bga
).

AMD Flash memory devices are guaranteed for a minimum of one million write cycles per sector and 20 years' data retention, making them the most reliable non-volatile memory devices in the industry.

About LSI Logic

LSI Logic Corporation (NYSE: LSI) is a leading supplier of communications chips for broadband, data networking, wireless and set-top box applications. In addition, the company provides chips and boards for network computing and supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1551 McCarthy Boulevard, Milpitas, CA 95035, 408-433-8000, http://www.lsilogic.com.

Editor's Notes:

1. All LSI Logic news releases (financial, acquisitions,

manufacturing, products, technology etc.) available on their

company's website: http://www.lsilogic.com.

2. The LSI Logic logo design is a registered trademark of LSI Logic

Corporation.

3. AMD, the AMD logo and combination thereof are trademarks of

Advanced Micro Devices, Inc.

4. All other brand or product names may be trademarks or registered

trademarks of their respective companies.
COPYRIGHT 2000 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2000, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

 Reader Opinion

Title:

Comment:



 

Article Details
Printer friendly Cite/link Email Feedback
Publication:Business Wire
Date:Oct 23, 2000
Words:649
Previous Article:IDC Names Trend Micro World Leader In Internet Gateway Antivirus Market -- IDC Report Places Company's Worldwide Market Share At 54.3%; Market Shifts...
Next Article:Qualis expands operations into Europe; New European Headquarters in Grenoble, France to Spearhead Verification IP Development; Andrew Betts Joins as...
Topics:



Related Articles
Rick Marz Joins LSI Logic as Senior VP and GM, North America Marketing and Sales.
VoCAL Technologies and LSI Logic Sign Agreement to Collaborate On DSP Software Applications for the ZSP Processor.
IronBridge Networks and LSI Logic Produce Four Flawless ASIC Solutions for Next-Generation Terabit Routers Ahead of Schedule.
Elie Antoun Named New President/CEO of MediaQ; Former Executive Vice President of LSI Logic's Consumer Products Division to Lead MediaQ's Growth In...
Moscape Announces Integration of GateScope Into LSI Logic's FlexStream Design System for Noise Signoff.
LSI LOGIC AND WIND RIVER DELIVER COST-EFFECTIVE TURNKEY SOLUTION FOR SWITCHEDETHERNET MARKET.
IBM and LSI Logic Announce Technology Licensing Agreement; ASIC Leaders to Broaden Use of ZSP DSP Technology in Custom Chips.
IBM AND LSI LOGIC ANNOUNCE TECHNOLOGY LICENSING AGREEMENT.
LSI LOGIC AND AXYS DESIGN ANNOUNCE INTEGRATION OF ZSP DSP MODELS IN AXYS DESIGN'S MAXLIB COMPONENT LIBRARY.
AMD selects Atrenta's SpyGlass to predict downstream design issues early in the design cycle.

Terms of use | Copyright © 2012 Farlex, Inc. | Feedback | For webmasters | Submit articles