AMD Selects Teradyne's J973EP to Test Products with Next-Generation HyperTransport Interconnect Technology.Business/Technology Editors AGOURA HILLS, Calif.--(BUSINESS WIRE)--May 16, 2001 Teradyne, Inc. (NYSE NYSE See: New York Stock Exchange :TER Third version. See bis. ) announced that Advanced Micro Devices (AMD (Advanced Micro Devices, Inc., Sunnyvale, CA, www.amd.com) A major manufacturer of semiconductor devices including x86-compatible CPUs, embedded processors, flash memories, programmable logic devices and networking chips. ) has selected the J973EP VLSI VLSI: see integrated circuit. (1) (Very Large Scale Integration) Between 100,000 and one million transistors on a chip. See SSI, MSI, LSI and ULSI. (2) (VLSI Technology, Inc., Tempe, AZ, www.semiconductors. Test System with the inSync Differential Test(TM) option to test the recently introduced HyperTransport(TM) bus. The HyperTransport I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output. I/O - Input/Output Link is designed to reduce bottlenecks and speed the flow of data inside computers, servers, and networking devices that power the Internet. Additionally, AMD plans to use HyperTransport technology to help servers, workstations and PCs powered by its next-generation "Hammer" family of processors reach new pinnacles of performance. "AMD developed the HyperTransport Bus to speed up the way computer chips communicate with each other," said Gabriele Sartori, Director of Technology Evangelism Evangelism Gantry, Elmer fire and brimstone, fraudulent revivalist. [Am. Lit.: Elmer Gantry] John disciple closest to Jesus. [N.T.: John] Luke early Christian; the “beloved physician.” [N.T. at AMD. "But these new technologies create quality assurance testing challenges for chipmakers. We have worked closely with Teradyne to develop solutions to test our next-generation products. Teradyne's differential test solution helps enable companies to test and verify HyperTransport technology-enabled products capable of transmitting 1.6 billions bits of data per second on each pair of wires." "AMD is confident in selecting the J973EP and its differential test option as one of the avenues for testing the HyperTransport bus," said Roger Pineiro, Director of Product / Test Engineering, AMD. "The selection of the J973EP is an extension of AMD's twenty year relationship with Teradyne that has produced leading-edge production test solutions for multiple generations of microprocessors." "The HyperTransport(TM) Bus enables semiconductor devices to communicate with each other at an unprecedented 1.6 Gbps. This exciting new technology presented new test challenges in the area of speed, accuracy and differential signaling Using two wires for each electrical path for high immunity to noise and crosstalk. The signals are sent down one wire as positive and the other as negative, and the circuit at the receiving end derives the signal from the difference between the two. ," said Rod Stewart, Product Marketing Manager, Teradyne. "We are pleased that AMD has selected Teradyne's J973EP inSync Differential Test Option, the ATE industry's first 1.6 Gbps differential test solution." J973EP VLSI Test System The J973EP with the inSync Differential Test option is the first VLSI test system to provide 1.6 Gbps differential bus test capability and the first to expand performance with a 200A Device Power Supply. The expanded performance of the J973EP with Real Time Enabling(TM) enables high-performance device manufacturers to shift between structural and full-performance test, or balance both types of test, to minimize test cost. The J973EP provides manufacturers of microprocessors, core logic, integrated processors and graphic devices with the ability to increase frequency, accuracy, timing edgesets, and pattern memory performance. About HyperTransport(TM) Technology AMD's HyperTransport technology is a new high-speed, high-performance, point-to-point link for integrated circuits Integrated circuits Miniature electronic circuits produced within and upon a single semiconductor crystal, usually silicon. Integrated circuits range in complexity from simple logic circuits and amplifiers, about 1/20 in. (1. . HyperTransport provides a universal connection that is designed to reduce the number of buses within the system, provide a high-performance link for embedded applications, and enable highly scalable multiprocessing systems. It was developed to enable the chips inside of PCs, networking and communications devices to communicate with each other up to 24 times faster than with existing technologies. Compared with existing system interconnects that provide bandwidth up to 266MB/sec, HyperTransport technology's bandwidth of 6.4GB/sec represents better than a 20-fold increase in data throughput. HyperTransport technology provides an extremely fast connection that complements externally visible bus standards like the Peripheral Component Interconnect See PCI. (hardware) Peripheral Component Interconnect - (PCI) A standard for connecting peripherals to a personal computer, designed by Intel and released around Autumn 1993. PCI is supported by most major manufacturers including Apple Computer. (PCI (1) (Payment Card Industry) See PCI DSS. (2) (Peripheral Component Interconnect) The most widely used I/O bus (peripheral bus). ), as well as emerging technologies like InfiniBand. HyperTransport technology is the connection that is designed to provide the bandwidth that the new InfiniBand standard requires to communicate with memory and system components inside of next-generation servers and devices that may power the backbone infrastructure of the telecom industry. HyperTransport technology is targeted primarily at the information technology and telecom industries, but any application in which high speed, low latency Low latency allows human-unnoticeable delays between an input being processed and the corresponding output providing real time characteristics. This can be especially important for internet connections utilizing services such as online gaming and VOIP - VOIP is not as important as and scalability is necessary can potentially take advantage of HyperTransport technology. About Teradyne Teradyne (NYSE: TER) is the world's largest supplier of automatic test systems and high performance interconnection systems for the electronics, telecommunications and Internet industries. Teradyne products are used to test semiconductors, printed circuit board assemblies, telephone lines and broadband networks  This article or section needs copy editing for grammar, style, cohesion, tone and/or spelling.You can assist by [ editing it] now. . Teradyne's backplane An interconnecting device that has sockets for printed circuit boards to plug into. Passive and Active Although resistors may be used, a "passive" backplane adds no processing in the circuit. assemblies and high-density connectors are used in the communications and computing systems central to the Internet infrastructure. In 2000, the company had sales of $3.0 billion and year-end headcount was over 10,000 employees. AMD, the AMD logo, and combinations thereof, and HyperTransport are trademarks of Advanced Micro Devices, Inc. InSync Differential Test and Real Time Enabling are trademarks of Teradyne, Inc. All other product names are used for identification purposes only and may be trademarks of their respective companies |
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