Printer Friendly
The Free Library
14,678,647 articles and books
Member login
User name  
Password 
 
Join us Forgot password?

AMD Selects Axcelis for New Single-Wafer Implant Technology; New Platform Targets Low Energy, High-Tilt Applications Through 45nm.


BEVERLY, Mass. -- Axcelis Technologies Axcelis Technologies, Inc. NASDAQ: ACLS engages in the design, manufacture, and servicing of capital equipment for the semiconductor manufacturing industry worldwide. , Inc. (NASDAQ NASDAQ
 in full National Association of Securities Dealers Automated Quotations

U.S. market for over-the-counter securities. Established in 1971 by the National Association of Securities Dealers (NASD), NASDAQ is an automated quotation system that reports on
: ACLS ACLS
abbr.
advanced cardiac life support
) today announced that it will provide innovative low energy, single-wafer implant technology to AMD's new 300mm fab in Dresden, Germany. AMD (Advanced Micro Devices, Inc., Sunnyvale, CA, www.amd.com) A major manufacturer of semiconductor devices including x86-compatible CPUs, embedded processors, flash memories, programmable logic devices and networking chips.  chose Axcelis' new single-wafer technology because it is the only platform that meets the chipmaker's device manufacturing requirements for well and channel and high-tilt HALO implant applications in the 90nm to 45nm technology nodes.

Device scaling beyond the 90nm technology node drives the need for lower energy implant processing in all areas of the transistor. Axcelis has been developing a new single-wafer platform in anticipation of the industry's growing need for greater productivity and doping doping, in electronics: see semiconductor.


Altering the electrical conductivity of a semiconductor material, such as silicon, by chemically combining it with foreign elements.
 precision in high-tilt, low energy implant applications. Axcelis plans to formally unveil the new single-wafer platform in early 2005.

"Being the leader in highly productive low energy implant is the result of our ongoing commitment to technology development and close customer collaborations. This approach, coupled with our market insight, enables us to deliver the most precise and productive tools for our customers," said Mike Luttati, Axcelis' chief operating officer Chief Operating Officer (COO)

The officer of a firm responsible for day-to-day management, usually the president or an executive vice-president.
. "The inherent design of our new platform and low energy performance clearly provided AMD with a solution to meet their current and future needs. As devices scale, energy, contamination and angle control play a much larger role, and our platform excels in these areas."

About AMD

AMD (NYSE NYSE

See: New York Stock Exchange
:AMD) designs and produces innovative microprocessors, Flash memory devices and low-power processor solutions for the computer, communications and consumer electronics industries. AMD is dedicated to delivering standards-based, customer-focused solutions for technology users, ranging from enterprises and governments to individual consumers. For more information, visit www.amd.com.

About Axcelis Technologies, Inc.

Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing Rapid Thermal Processing (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less.  and cleaning and curing systems. Axcelis Technologies has key technology centers in Beverly, Massachusetts and Rockville, Maryland, as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com.

Forward-Looking Statements

This press release includes certain statements, known as "forward-looking statements," which express the current expectations of Axcelis management. Product manufacturing and delivery issues, customer order push-outs or cancellations and product performance could cause actual results to differ materially from those currently anticipated as expressed in this press release. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K Form 10-K

A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information.


Form 10-K

See 10-K.
 filed by Axcelis and in other filings from time to time with the Securities and Exchange Commission.
COPYRIGHT 2004 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2004, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

 Reader Opinion

Title:

Comment:



 

Article Details
Printer friendly Cite/link Email Feedback
Publication:Business Wire
Geographic Code:1USA
Date:Nov 30, 2004
Words:431
Previous Article:Zacks Buy List Highlights: American Power Conversion, Parker Hannifin, Navistar Int'l, and Tempur-Pedic Int'l.
Next Article:Torrent Energy Issues Core Drilling Update.
Topics:



Related Articles
Axcelis Introduces MC3 for 300 mm Medium Current Ion Implantation; Production Proven Platform Designed for Low Risk Transition to 300 mm Production.
Varian Semiconductor announces new VIISta platform offering.(Varian Semiconductor Equipment VIISta 810 HP)(Product Announcement)
Axcelis' Newest Ion Implanter Delivers Broadest Range of Capabilities for Advanced Transistor Formation.
New Infineon-Nanya Joint Venture Places $18 Million Order for Suite of Axcelis Ion Implanters.
Major Fab in Taiwan Orders Axcelis' MC3 Medium Current Ion Implanters; Axcelis' Record of Outstanding Customer Support Key to Order Win.
Axcelis Breaks Productivity Barrier with New Generation of Ultra Implanters.
Axcelis Achieves #1 Market Share in Ion Implantation for Third Straight Year.
Axcelis Marks Another Low Energy Implant Advance with Cluster Boron Beams; New SemEquip source offers 18X boost in low energy productivity.
Axcelis' Single Wafer Optima Technology Earns Win in Japan; SEN Joint Venture Secures Order for High Dose Implanter from Key Logic Manufacturer.
AMD Places Second Order for Axcelis' Single Wafer Optima Technology; Optima's Implant Precision and Angle Control Key Advantages in Forming AMD's...

Terms of use | Copyright © 2009 Farlex, Inc. | Feedback | For webmasters | Submit articles