AMD Offers Highest Performance 32 Megabit Flash; Continued Leadership in High Density Flash.SUNNYVALE, Calif.--(BUSINESS WIRE)--March 1, 1999--AMD today announced the Am29LV033, the industry's fastest 3.0 volt 32-Megabit flash memory device. The Am29LV033 represents the latest addition to AMD's broad range of high-density flash devices. Designed using advanced 0.32 micron flash technology, the device is capable of access times as fast as 70 nanoseconds. "With the introduction of the Am29LV033, AMD (Advanced Micro Devices, Inc., Sunnyvale, CA, www.amd.com) A major manufacturer of semiconductor devices including x86-compatible CPUs, embedded processors, flash memories, programmable logic devices and networking chips. can help designers create highly integrated solutions without sacrificing performance," said Walid Maghribi, group vice president of AMD's Memory Group. "The Am29LV033 allows 32-Megabit flash to be utilized in a wider range of applications due to its industry-leading characteristics such fast access times, single-supply operation and zero-power operation." To address increasingly stringent system power constraints, the Am29LV033 includes sophisticated power management capabilities. The device consumes very low power during operation, and zero power during standby or automatic sleep mode. In addition, AMD guarantees a minimum of one million write cycles and a 20-year data retention period for the Am29LV033. Applications The Am29LV033 is targeted for applications requiring large code or data storage and high performance. The device's x8 uniform sector architecture, fast speed, and space-saving FBGA FBGA Fine-Pitch Ball Grid Array FBGA Fine Pitch Bga FBGA Fine Line Bga and TSOP (Thin Small Outline Package) A very thin, plastic, rectangular surface mount chip package with gull-wing pins on its two short sides. TSOPs are about a third as thick as SOJ chips. See gull-wing lead, SOP, SOJ and chip package. packages are ideal for high density applications such as flash cards and resident flash arrays in telecom and networking applications. Package and Price The Am29LV033 is available in a 40-lead TSOP package, priced at $14.50 in quantities of 10,000. The device is also available in a 0.8mm 48-ball FBGA (Fine pitch BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. ) chip scale package A chip scale package (CSP) (sometimes, chip-scale package with a hyphen) is a type of integrated circuit chip carrier. According to the IPC, to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die that is being packaged. . FBGA packaging is well suited for space limited systems due to its significantly smaller dimensions relative to other packages. About AMD AMD is a global supplier of integrated circuits Integrated circuits Miniature electronic circuits produced within and upon a single semiconductor crystal, usually silicon. Integrated circuits range in complexity from simple logic circuits and amplifiers, about 1/20 in. (1. for the personal and networked computer and communications markets. AMD produces processors, flash memories, programmable logic devices, and products for communications and networking applications. Founded in 1969 and based in Sunnyvale, California, AMD had revenues of $2.5 billion in 1998. (NYSE NYSE See: New York Stock Exchange :AMD). WORLD WIDE WEB: Press announcements and other information about AMD are available on the Internet via the World Wide Web. Type http://www.amd.com at the URL URL in full Uniform Resource Locator Address of a resource on the Internet. The resource can be any type of file stored on a server, such as a Web page, a text file, a graphics file, or an application program. prompt. NOTE TO EDITOR: Readers may obtain additional information by calling 1 (800) 222-9323 or (408) 749-5703. AMD, the AMD logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. |
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