AMD Mobile Processors to Power Hewlett-Packard's Pavilion Notebook PCs.Business Editors/High-Tech Writers S CES 2000 SUNNYVALE, Calif.--(BUSINESS WIRE)--Jan. 6, 2000 AMD (Advanced Micro Devices, Inc., Sunnyvale, CA, www.amd.com) A major manufacturer of semiconductor devices including x86-compatible CPUs, embedded processors, flash memories, programmable logic devices and networking chips. today announced that it has expanded it's customer base for the Mobile AMD-K6(R)-2-P processor. Hewlett-Packard Company has chosen the Mobile AMD-K6-2-P processor to power two new systems in its Pavilion notebook PC series. Announced today at the Consumer Electronic Show in Las Vegas Las Vegas (läs vā`gəs), city (1990 pop. 258,295), seat of Clark co., S Nev.; inc. 1911. It is the largest city in Nevada and the center of one of the fastest-growing urban areas in the United States. , Nev., the Pavilion notebook PC series will use the 475MHz (MegaHertZ) One million cycles per second. It is used to measure the transmission speed of electronic devices, including channels, buses and the computer's internal clock. A one-megahertz clock (1 MHz) means some number of bits (16, 32, 64, etc. and 433MHz versions of the Mobile AMD-K6-2-P processor. "The HP Pavilion HP Pavilion may refer to:
"HP welcomes the addition of the Mobile AMD-K6-2-P processors to its versatile line of Pavilion notebook PCs," said Hilary Glann, worldwide marketing manager for HP's Mobile Computing Division. "By including Mobile AMD processors in our Pavilion notebook line, HP is best able to offer consumers a comprehensive set of reliable and cost-effective mobile solutions from which to choose." About The Mobile AMD-K6(R)-2-P Processor Family The Mobile AMD-K6-2-P processor with 3DNow!(TM) technology delivers excellent performance for today's demanding Microsoft(R) Windows(R) compatible home and office applications. The 9.3-million-transistor Mobile AMD-K6-2-P processor is manufactured on AMD's 0.25-micron, five-layer-metal process technology using local interconnect and shallow trench isolation Shallow trench isolation (STI) is an integrated circuit feature which prevents electrical current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology nodes of 250 nanometers and smaller. at AMD's Fab 25 wafer fabrication facility in Austin, Texas. The Mobile AMD-K6-2-P processor is packaged in a Super7(TM) platform-compatible, 321-ceramic pin grid array See PGA. (hardware) Pin Grid Array - (PGA) A style of integrated circuit socket or pin-out with pins laid out on a square or rectangular grid with a separation of 0.1 inch in each direction. The pins near the centre of the array are often missing. (CPGA (Ceramic PGA) See PGA. CPGA - Ceramic Pin Grid Array ) package using C4 flip-clip interconnection technology. About 3DNow!(TM) Technology 3DNow! Technology, developed by AMD, was the first innovation to the x86 architecture that significantly enhanced floating-point-intensive 3D graphics and multimedia applications. It uses single instruction multiple data (SIMD (Single Instruction stream Multiple Data stream) A computer that performs one operation on multiple sets of data. It is typically used to add or multiply eight or more sets of numbers at the same time for multimedia encoding and rendering as well as scientific ) and other performance enhancements to provide a compelling visual computing experience. The worldwide installed base of 3DNow! Technology-enhanced PCs has grown to more than 20 million desktop and notebook systems. Support for 3DNow! Technology exists today in leading industry-standard application programming interfaces (APIs), including Microsoft's DirectX 6.x and SGI's OpenGL APIs. In addition, numerous hardware and software products have been optimized for 3DNow! Technology. For a detailed list of hardware and software products that support 3DNow! technology, visit the AMD web site at http://www1.amd.com/products/cpg/3dnow/optimized. Leading software titles optimized for 3DNow! technology are available online at the 3DNow! Technology Aisle on Chumbo.com. About AMD AMD is a global supplier of integrated circuits for the personal and networked computer and communications markets. AMD produces microprocessors, flash memories, and integrated circuits for communications and networking applications. Founded in 1969 and based in Sunnyvale, AMD had revenues of $2.5 billion in 1998. (NYSE NYSE See: New York Stock Exchange :AMD). Cautionary Statement This release contains forward-looking statements, which are made pursuant to the safe harbor Safe Harbor 1. A legal provision to reduce or eliminate liability as long as good faith is demonstrated. 2. A form of shark repellent implemented by a target company acquiring a business that is so poorly regulated that the target itself is less attractive. provisions of the Private Securities Litigation Reform Act The Private Securities Litigation Reform Act of 1995 (PSLRA) implemented several significant substantive changes affecting certain cases brought under the federal securities laws, including changes related to pleading, discovery, liability, class representation and awards fees and of 1995. Forward-looking statements are generally preceded by words such as "plans," "expects," "believes," "anticipates" or "intends." Investors are cautioned that all forward-looking statements in this release involve risks and uncertainty that could cause actual results to differ materially from current expectations. Forward-looking statements in this release include the risk that the HP Pavilion notebook PC notebook computer systems incorporating Mobile AMD-K6-2-P processors will not be released on schedule or at all. We urge investors to review in detail the risks and uncertainties in the Company's filings with the Securities Exchange Commission. Note to Editors: AMD, the AMD logo, K6, 3DNow! and combinations thereof and Super7 are trademarks and AMD-K6 is a registered trademark of Advanced Micro Devices, Inc. in the United States and other jurisdictions. Microsoft and Windows are registered trademarks of Microsoft Corporation in the United States and other jurisdictions. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. |
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