Printer Friendly
The Free Library
4,465,324 articles and books
Member login
User name  
Password 
 
Join us Forgot password?

AMD Announces a Major Advancement in Flash Memory Test Technology; Industry Leading Access Speeds Now Available In Known Good Die -- KGD -- Form.


Business Editors and High-Tech Writers

SUNNYVALE, Calif.--(BUSINESS WIRE)--Feb. 26, 2001

AMD (NYSE:AMD) today announced a major advancement in Flash memory (1) See also Flash.

(2) A rewritable memory chip that holds its content without power. Flash evolved from the EEPROM chip, and its name was coined by Toshiba to express how much faster it could be erased ("in a flash"). See EEPROM.

Flash is widely used for storage modules such as USB drives and digital camera memory cards (see examples below). It is also packaged as stand-alone chips for circuit board mounting.
 test technology that allows the company to test bare die See bare chip., Burst Mode A high-speed transmission mode in a communications or computer channel. Under certain conditions, the system sends a burst of data at higher speed for a limited amount of time. For example, a multiplexor channel may suspend transmitting several streams of data and send one high-speed transmission using the entire bandwidth. Flash memory devices.

This breakthrough enables AMD to guarantee high performance Flash memory in a smaller, space saving form factor that can operate at very high temperatures. Advanced automotive engine control units, network cards and handheld organizers are some of the applications that will benefit from this technology. As a result of these latest developments, AMD introduced the Am29BL162C, a 16Mb Burst mode Flash memory device in the extraordinarily small AMD Known Good Die (KGD KGD - Kaliningrad, Russia - Kaliningrad Airport (Airport Code)
KGD - King's Gambit Declined (chess)
KGD - Known Good Die (semiconductor industry)
KGD - Komitee Für Grundrechte Und Demokratie
) form factor.

Devices that are in a bare die/unpackaged form are extremely difficult to test. AMD, however, has developed an innovative series of complex test and manufacturing procedures that allow the company to offer AMD KGD Flash memory products. These bare die devices are completely tested for functionality and speed. In fact, AMD guarantees that its KGD products have the same reliability and quality as AMD Flash memory in packaged form.

"AMD is leading the industry in pioneering test solutions," said Joe Rauschmayer, vice president of product line engineering for AMD's Memory Group. "AMD's extensive investments in the research and development of proprietary test technologies enable us to guarantee Flash memory in KGD form. By building on the experience gained from shipping more than 10 million KGD devices, AMD is now able to deliver the high performance Burst Mode, KGD solutions that our customers demand."

The KGD form also allows customers to use AMD Flash memory devices at temperatures that are higher than those allowed by conventional packaging. The Am29BL162C can operate at temperatures of 145(0)C. This ability to operate reliably at very high temperatures makes Burst Mode KGD Flash memory ideal for advanced automotive engine control systems where high performance under extreme conditions is required.

Am29BL162C, the industry's first 16Mb, KGD, Burst Mode device offers random read access times of 80 ns, and subsequent access times as fast as 22 ns. Since Burst Mode devices offer faster access times than asynchronous memory, the execution code can be stored directly within the Flash, eliminating the need for additional RAM or multiple interleaved Flash devices. These devices can often be interfaced directly to the processor, eliminating expensive glue logic A simple logic circuit that is used to connect complex logic circuits together. For example, an ASIC chip may contain large functions, such as a microprocessor, memory block or communications block, which are tied together via small amounts of glue logic. At the printed circuit board (PCB) level, glue logic may be implemented with simple "jelly bean" chips ("glue chips") that contain a few gates all the way to programmable logic devices (see PLD). thereby allowing designers to reduce the number of components used, the amount of power consumed and, ultimately, the overall system cost.

The Am29BL162C has very low power consumption with a read current as low as 15 mA depending on the burst speed and an extremely low standby current of only 22 uA. The 16Mb device is compatible with JEDEC standards and is backward compatible with AM29LVxx and Am29Fxxx Flash memory devices.

Applications

Embedded applications such as automotive engine control units, GPS, network interface cards, printers, modems, industrial controls, digital set-top boxes, and handheld organizers are some of the applications that can utilize the AM29BL162C high performance Flash memory device.

Price and Availability

The AM29BL162C is available now. Pricing is $13.20 in quantities of 10,000.

AMD Flash Memory Awards

AMD has been the recipient of numerous customer service, quality and technology awards. The most recent Flash memory awards include: Cisco Systems' highest customer satisfaction recognition -- the Cisco President's Award, the Nortel 2000 "Supplier of the Year" award, the Samsung 2000 "Best Supplier" award, the Volkswagen 1999 "Leading Edge" award and the Cisco 1999 "Semiconductor Supplier of the Year" award.

About AMD Flash Memory Devices

AMD technology is employed by the world's largest producer of Flash memory devices, Fujitsu AMD Semiconductor Ltd. (FASL FASL - Feet Above Sea Level). AMD Flash memory products encompass a broad spectrum of densities and features to support a wide range of markets. AMD Flash memory customers represent leaders in the automotive, networking, telecommunications and handheld mobile terminal markets. AMD offers many Flash memory products, such as the award-winning Simultaneous Read-Write (SRW) product family; Super Low Voltage 1.8V Flash memory devices; and Burst-and Page-Mode devices. AMD developed the robust Known Good Die (KGD) program and the patented negative gate erase technology, and refined the industry-standard Fine-pitch Ball Grid Array (FBGA).

All AMD Flash memory devices are guaranteed by AMD for a minimum of one million write cycles per sector and 20 years' data retention, making them the most reliable non-volatile memory devices in the industry.

About AMD

AMD is a global supplier of integrated circuits for the personal and networked computer and communications markets with manufacturing facilities in the United States, Europe, Japan, and Asia. AMD produces microprocessors, flash memory devices, and support circuitry for communications and networking applications. Founded in 1969 and based in Sunnyvale, Calif., AMD had revenues of $4.6 billion in 2000. (NYSE:AMD).

AMD is a trademark of Advanced Micro Devices Inc.
COPYRIGHT 2001 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2001, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

 Reader Opinion

Title:

Comment:



 

Article Details
Printer friendly Cite/link Email Feedback
Publication:Business Wire
Geographic Code:1USA
Date:Feb 26, 2001
Words:798
Previous Article:TietoEnator Strengthens Its Co-Operation in Sweden with Capella and Sells Its Operations Within Graphical Services.
Next Article:Vodavi Year-End Conference Call On March 1 At 11 a.m. Eastern.
Topics:



Related Articles
AMD Announces Flash Memory Agreement With Siemens Automotive.
AMD to Double Flash Memory Supply to Cisco Systems.
AMD AND M-SYSTEMS TO COLLABORATE ON HIGH-DENSITY EMBEDDED STORAGE SOLUTIONS FOR MOBILE MARKETS.(Company Business and Marketing)
AMD INTROS INDUSTRY'S FASTEST 128MB FLASH MEMORY DEVICE.(Am29PDL128 flash memory device)(Product Announcement)
SST: LPC FLASH MEMORY SUPPORT FOR UPCOMING AMD OPTERON AND EIGHTH-GEN AMD ATHLON PROCESSORS.(Product Announcement)
AMD intros the lowest power flash memory device for high-end cellular phones.(AMD's Am29BDS640G flash memory unit)(Product Announcement)
AMD intros high-performance Flash memory device.(AMD Am29PDL640G)
Is SiP haunted by the MCM ghost? Thanks to cellphones, stacked-die packages are ringing up gains.(On the Forefront)
3-D packaging gets ready for prime time: among the benefits: improved RC delay and power consumption.(On the Forefront)
For consumer products, thin is in: but the ideal package solution is up for debate.(On the Forefront)

Terms of use | Copyright © 2008 Farlex, Inc. | Feedback | For webmasters | Submit articles