AIT issued patterned leadframe patent.SINGAPORE -- Advanced Interconnect Technologies (aithome.com) has been granted a U.S. patent covering a process for manufacturing and using partially patterned leadframes with near-chip scale packaging lead-counts. U.S. Patent no. 7,129,116, issued Oct. 16, is said to help the creation of smaller QFN QFN Quad Flat No-Lead QFN Queen Fan Newsletter (rock band) QFN Quad Flat No Leads packages with increased I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output. I/O - Input/Output and smaller footprints. The leadframe is designed as a partially patterned strip of metal. One side is shaped into a web-like surface, while the other side is solid and flat. The design reportedly makes the lead-frame mechanically rigid and thermally robust, eliminating distortion and deformation deformation /de·for·ma·tion/ (de?for-ma´shun) 1. in dysmorphology, a type of structural defect characterized by the abnormal form or position of a body part, caused by a nondisruptive mechanical force. 2. during chip attach and wire bonding Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The wire is generally made up of one of the following:
The patterned leadframes can be singulated without cutting into additional metal. The bottom-side of the metal leadframe is patterned to isolate the chippad, and the wire bond contacts only after the front side, including the chip and wires, is encapsulated encapsulated Localized Oncology adjective Confined to a specific area, surrounded by a thin layer of fibrous tissue; encapsulation generally refers to a tumor confined to a specific area, surrounded by a capsule. See Islet encapsulation. . The package is therefore electrically isolated and enables pre-singulation strip testing, and eliminating additional metal cutting extends the saw blade life. |
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