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ADVISORY/The Advanced Packaging and Interconnect Seminar to be Held at Semicon Taiwan.


News/Assignment Editors & High-Tech high-tech also hi-tech
adj. Informal
Of, relating to, or resembling high technology.


high-tech
Adjective

same as hi-tech

Adj. 1.
 Writers

ADVISORY...for Monday Monday: see week.  (Sept. 16)

--(BUSINESS WIRE)


    Event: The Advanced Packaging and Interconnect Alliance (APiA),
        along with Pennwell Publishing, Advanced Packaging Magazine
        and Solid State Technology will sponsor an Advanced Packaging
        and Interconnect Seminar at Semicon Taiwan.

        The latest bump and chip scale packaging market trends and
        technology advancements will be presented by industry leaders
        including:
        --  Chipbond
        --  TSMC
        --  ASE
        --  Dow Corning
        --  DEK Printing Machines
        --  INFRASTRUCTURE
        --  SEZ

    When and Where: Semicon Taiwan
                    Monday, September 16, 2002 8:00 am -1:30 pm
                    Breakfast and lunch served Grand Hyatt
                    Hotel Taipei Ballroom II
                    http://taipei.hyatt.com/taigh/loca/map1.html

    Register: Online at:
        http://www.apialliance.com/semicon_west/index.shtml or email:
        judy.hsu@augusttech.com.

    Future Events: A seminar is scheduled during Semicon Japan on
        December 5, 2002. Visit www.apialliance.com for further
        information and other upcoming events.

COPYRIGHT 2002 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2002, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:Business Wire
Date:Aug 28, 2002
Words:145
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