ADVISORY/Picolight to Host Live Demo of a 1310nm XPAK.

Business Editors & High-Tech Writers

ADVISORY...for Monday-Wednesday (Sept. 16-18)

NFOEC 2002

Dallas Convention Center, Booth #2941

--(BUSINESS WIRE)

Picolight Inc.

Product Demo: Picolight to host live demo of a 1310nm XPAK fiber-optic module optimized for enterprise, storage area network (SAN) and switching center market segment applications, interoperating with a larger-form-factor XENPAK module -- showing 100 percent compatibility.

WHO:    Picolight Inc.

WHEN:   Monday, Sept. 16, through Wednesday, Sept. 18, 2002.

WHAT:   XPAK is a multi-source agreement between multiple transceiver
        vendors that defines a smaller version of XENPAK. XPAK, like
        XENPAK, is a pluggable 10 Gigabit optical transceiver. XPAK
        addresses several of the customer complaints about XENPAK by
        defining a shorter, PCI-capable module that does not require a
        board cut out.

        Picolight's demonstration features a live 1310nm XPAK module
        inserted into an XENPAK slot, running 10 Gigabit Ethernet
        traffic, and shows the direct compatibility of an XPAK module
        within an existing XENPAK slot.

WHY:    Interoperability demonstrations prove XAUI electrical
        interoperability between XPAK and XENPAK, and show the
        straightforward migration path between XENPAK and the smaller
        XPAK modules.  This is an important step toward mass
        deployment of the more cost-effective, compact XPAK form
        factor.

        With an optimized form factor that directly addresses
        enterprise and SAN market and application needs, XPAK
        leverages the strength of XENPAK without the overhead of
        large, power-intensive transport optics.  XPAK defines a
        smaller, more cost-effective form factor for 10 Gigabit
        fiber-optic modules, and provides new levels of density, power
        efficiency and ease-of-integration to network equipment OEMs
        implementing 10 Gigabit links up to 10 kilometers.

        These features allow deployment of 10 Gigabit Ethernet to move
        from today's aggregated uplink applications to high-volume
        server-to-switch and storage-to-switch links. The XPAK design
        enables up to 20 devices to be installed on a single, 19-inch
        printed circuit board, and also enables PCI card applications,
        such as 10 Gigabit Ethernet network interface cards.

        XPAK can support 10 Gigabit Ethernet and Fibre Channel optical
        links from 2 meters to 10 kilometers, which represents the
        majority of connection requirements for these market segments.
        XPAK can also be plugged directly into the front panel of
        optical systems while they are still operating
        ("hot-pluggable"), which increases OEM manufacturing yields,
        reduces inventory costs and enables devices to be replaced or
        upgraded in the field, and enables a "pay-as-you-populate"
        model for systems.

        XPAK allows network equipment OEMs to easily migrate their
        first-generation 10 Gigabit designs to higher-density,
        lower-power implementations using their existing interface
        components and software.

WHERE:  Demonstrations will be conducted throughout the conference at
        the Picolight booth #2941.