ADVISORY/Photos regarding world's most advanced chip-making facility are available on BW PhotoWire/AP PhotoExpress, NewsCom, PressLink and Business Wire's Web Site.Photo/Business Editors/High-Tech Writers ADVISORY... --(BUSINESS WIRE) The photo is BW1 on AP PhotoExpress. The photo is on Business Wire's Web Site at http://www.businesswire.com/cgi-bin/photo.cgi?pw.101000/bw1 Photo caption reads: EAST FISHKILL, N.Y.--(BUSINESS WIRE) Left photo: IBM (International Business Machines Corporation, Armonk, NY, www.ibm.com) The world's largest computer company. IBM's product lines include the S/390 mainframes (zSeries), AS/400 midrange business systems (iSeries), RS/6000 workstations and servers (pSeries), Intel-based servers (xSeries) plans to build the world's most advanced 300mm (12-inch) wafer (1) A small, thin continuous-loop magnetic tape cartridge that has been used from time to time for data storage and specialized applications. (2) The base unit of chip making. It is a slice taken from a salami-like silicon crystal ingot up to 12" (300mm) in diameter. semiconductor manufacturing facility in East Fishkill, NY. The new facility will combine--for the first time anywhere--IBM chip-making breakthroughs such as copper interconnects, silicon-on-insulator (SOI (Silicon On Insulator) A chip architecture that increases transistor switching speed by reducing capacitance (build-up of electrical charges in the transistor's elements), and thus reducing the discharge time. The power requirement is also reduced in some designs. ) and low-k dielectric dielectric (dī'ĭlĕk`trĭk), material that does not conduct electricity readily, i.e., an insulator (see insulation). A good dielectric should also have other properties: It must resist breakdown under high voltages; it should not insulation on 300mm wafers wafers compressed roughage in flat plates useful for feeding to animals in transit. . A 300mm wafer (on left) can yield 2.5 times more chips than a conventional 200mm (8-inch) wafer (on right). Right photo: IBM today announced a $5 billion investment in its chip-making business, including plans to build the world's most sophisticated, automated 300mm (12-inch) wafer semiconductor manufacturing facility in East Fishkill, NY. IBM's new 300mm plant will use the most advanced technology and equipment available to automatically transport specialized carriers--filled with 25 wafers--through an intricately optimized chip manufacturing process. (Business Wire photo) CONTACT: IBM Microelectronics, William O'Leary, 845/892-5582 (olearywt@us.ibm.com) See Business Wire story 2403 for more information. |
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