ADVISORY/Canon U.S.A. Semiconductor Equipment Division Unveils New U.S. Capability And Roadmap At SPIE Media Luncheon.Business/High Tech Editors ADVISORY...for Mon. (Feb. 24) --(BUSINESS WIRE) Canon has embarked on an aggressive marketing and technology effort with the goal to meet its market share and customer objectives within the next few years. The company is implementing its development efforts along all technology nodes See technology generation. from 248, 193, 157 thru NGL NGL - A dialect of IGL. . This is driven strongly by U.S. customer demands and Canon's worldwide objective to be #1 in lithography lithography (lĭthŏg`rəfē), type of planographic or surface printing. It is distinguished from letterpress (relief) printing and from intaglio printing (in which the design is cut or etched into the plate). within the next few years. On Monday Monday: see week. , February 24, the Semiconductor Equipment Division of Canon U.S.A., Inc., a subsidiary of Canon Inc. (NYSE NYSE See: New York Stock Exchange :CAJ CAJ Canadian Association of Journalists CAJ Christliche Arbeiterjugend (German Young Christian Workers) CAJ China Academic Journals CAJ Christian Academy in Japan CAJ Canaima, Venezuela (Airport Code) ), will host a media event to unveil its Roadmap Report Card. Canon will highlight current industry issues and those it is addressing along all technology nodes and the business environment. Canon will announce enhancements to its 6000 platform, which position the company as the leader in increased throughput The speed with which a computer processes data. It is a combination of internal processing speed, peripheral speeds (I/O) and the efficiency of the operating system and other system software all working together. 1. and performance issues. This event will provide an opportunity to meet key members of the Canon U.S. semiconductor management team. They will offer insights into Canon's current position on 157,193, 248 and NGL, including the current status of resists, pellicles, and other 157 nm lithography related challenges.
Who: Canon U.S.A. Semiconductor Equipment Division
Speakers: Kiyoshi Morishima, head of U.S. sales and marketing
Tommy Ogga, U.S. process technology and applications
engineering leader
Ray Morgan, strategic marketing and technology leader
Phil Ware, covering Canon's NGL strategy
What: Canon Press Conference/Information Exchange
Where: Alameda Room at the Santa Clara Westin hotel
(run in conjunction with SPIE2003)
When: Monday, February 24, 2003
Time: 12 noon-3:00 p.m Lunch will be served.
To register, please contact: Trine Pieirk, Positio PR, Phone: 602/485-0963, Email: trine@positiopr.com |
|
||||||||||||||||
Printer friendly
Cite/link
Email
Feedback
Reader Opinion