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ADVISORY/Applied Materials Introduces Deep Trench Etch Technology for Sub-100 Nanometer DRAM Manufacturing.


Business Editors & High-Tech Writers

ADVISORY...for Friday (July 13)

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--(BUSINESS WIRE)

Applied Materials Applied Materials, Inc. NASDAQ: AMAT (HKSE: 4336 ) is the global leader in nanomanufacturing technology solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel solar displays, solar  Inc. has introduced the Silicon Etch To create a design in a material by digging out the material. The circuit designs on printed circuit boards and chips are etched by acid. See chip and printed circuit board.  HART(tm) chamber for etching etching, the art of engraving with acid on metal; also the print taken from the metal plate so engraved. In hard-ground etching the plate, usually of copper or zinc, is given a thin coating or ground of acid-resistant resin.  high aspect ratio trenches to form capacitor capacitor or condenser, device for the storage of electric charge. Simple capacitors consist of two plates made of an electrically conducting material (e.g., a metal) and separated by a nonconducting material or dielectric (e.g.  structures on 200mm or 300mm wafers wafers

compressed roughage in flat plates useful for feeding to animals in transit.
. Developed in close cooperation with a major semiconductor manufacturer, the HART chamber is distinguished by its capability to etch greater than 60:1 aspect ratios with excellent process repeatability and uniformity at production-worthy etch rates, making it extendible to 100 nanometer devices and beyond.

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Publication:Business Wire
Geographic Code:1USA
Date:Jul 13, 2001
Words:168
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