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ADVISORY/Applied Materials Announces New 300mm Tungsten Deposition System.


Business Editors & High-Tech Writers

ADVISORY...for Monday (July 16)

NOTE TO EDITORS: Multimedia Assets Available With This Story Include

Logos, Photos, Text News Releases

--(BUSINESS WIRE)

Applied Materials Applied Materials, Inc. NASDAQ: AMAT (HKSE: 4336 ) is the global leader in nanomanufacturing technology solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel solar displays, solar  Inc. announces an industry-first tungsten tungsten (tŭng`stən) [Swed.,=heavy stone], metallic chemical element; symbol W; at. no. 74; at. wt. 183.85; m.p. about 3,410°C;; b.p. 5,660°C;; sp. gr. 19.3 at 20°C;; valence +2, +3, +4, +5, or +6.  deposition system, the Sprint Plus, enabling high productivity, advanced plug fill technology for 100nm and beyond device generations.

The Sprint Plus combines Applied Materials' new Atomic Layer Deposition A semiconductor manufacturing technique that deposits a single layer on a chip that is only one atom or one molecule thick. As elements on a chip decreased to below 100 nm, this essential technology for making the chip ever smaller became commercial after the turn of the 21st century.  (ALD ALD
abbr.
adrenoleukodystrophy


ALD,
n.pr See adrenoleukodystrophy.


ALD

aldolase.
) technology with its unique high-pressure (300 Torr) bulk fill CVD CVD Cardiovascular disease, see there  process on the company's Endura(R) SL platform to deliver void-free tungsten plugs in extremely small contact structures.

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Copyright 2001, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:Business Wire
Date:Jul 16, 2001
Words:162
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