Printer Friendly
The Free Library
19,573,962 articles and books
Member login
User name  
Password 
 
Join us Forgot password?

ADVISORY/Applied Materials' New CMP Enhancement Package Establishes the Performance and Productivity Standard for Oxide Applications.


Business Editors & High-Tech Writers

ADVISORY...for Monday (July 16)

NOTE TO EDITORS: Multimedia Assets Available With This Story

Include Logos, Photos, Text News Releases

--(BUSINESS WIRE)

Applied Materials Applied Materials, Inc. NASDAQ: AMAT (HKSE: 4336 ) is the global leader in nanomanufacturing technology solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel solar displays, solar  Inc. today announced the new Oxide HP enhancement package for its industry-leading Mirra Mesa(tm) CMP CMP (cytidine monophosphate): see cytosine.


(1) (CMP Media LLC, Manhasset, NY, www.cmp.com) Part of United Business Media, CMP is a leading integrated media company that offers a wide variety of publications and services in the information
 (chemical mechanical planarization) system. Setting a new performance and productivity standard for ILD (Inter Layer Dielectric) The insulation used between layers of aluminum or copper wire that interconnect the transistors in a chip. There are three to four layers in a memory chip and five to seven in a logic chip with hundreds of meters of wiring.  (inter-layer dielectric dielectric (dī'ĭlĕk`trĭk), material that does not conduct electricity readily, i.e., an insulator (see insulation). A good dielectric should also have other properties: It must resist breakdown under high voltages; it should not ) and PMD (Polarization Mode Dispersion) The type of dispersion that occurs in singlemode fiber due to a lack of perfect symmetry in the fiber and from external pressures on the cable. Light travels over singlemode fiber in two polarization states.  (pre-metal dielectric) oxide CMP applications, the Oxide HP package delivers 2x tighter topography control and 30 percent lower cost of ownership over the baseline performance of previous offerings, enabling higher productivity and extendibility to the sub-100 nanometer device node.

You can reach the story directly by going to http://www.newstream.com/cgi-bin/display_story.cgi?3488

This multimedia news story is for free and unrestricted use on your news information site (and for print or broadcast too). Visit http://www.newstream.com to download video, audio, text, graphics, and photos.

If you have any questions about the story, or about Newstream.com, please write to us at info@newstream.com.
COPYRIGHT 2001 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2001, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

 Reader Opinion

Title:

Comment:



 

Article Details
Printer friendly Cite/link Email Feedback
Publication:Business Wire
Geographic Code:1USA
Date:Jul 16, 2001
Words:172
Previous Article:ADVISORY/Applied Materials Launches New Atomic Layer Deposition Technology for Nanometer-Generation Chips.
Next Article:NetFORCE Wins Top 'Deploy' Rating in InfoWorld Review.
Topics:



Related Articles
Applied Materials Introduces Enabling Polysilicon CMP Process for Next-Generation Devices.
TSMC Receives Applied Materials' 100th Taiwan Shipment of the Mirra CMP System; Mirra System is CMP Production Tool of Record at the World's Largest...
Applied Materials Announces Advanced Copper CMP Processes; New Process Solutions for the Mirra Mesa CMP System Address Full Spectrum of Copper Design...
Applied Materials Achieves Milestone Shipment of 1,000th CMP System; Multiple System Order From Silterra Affirms Market and Technology Leadership of...
Applied Materials' New CMP Enhancement Package Establishes the Performance and Productivity Standard for Oxide Applications.
Applied Materials Achieves Key Industry Milestone: Ships 100th Copper CMP System to AMD for Its Fastest Microprocessor.
Applied Materials Extends Lead in CMP with 100th 300mm System Shipment; Reflexion CMP Systems Are Installed in Every 300mm Fab Worldwide.
Applied Materials Extends Copper/Low k Leadership with Innovative CMP Technology; Reflexion LK CMP System Planarizes Delicate Low k Interconnects at...
STMicro gets decent results on applied materials' copper CMP system.
Super-barrier film matches glass.

Terms of use | Copyright © 2012 Farlex, Inc. | Feedback | For webmasters | Submit articles