ADE Unveils Inline Copper CMP Metrology Tool.

SAN FRANCISCO -- NanoXam System Monitors Polishing Process on Patterned Wafers for Higher Yields

ADE Corporation (Nasdaq: ADEX), today introduced NanoXam(TM), the first noncontact, inline 3-D metrology system for copper CMP processes. NanoXam quickly and precisely measures copper dishing of wide lines and erosion of fine-line arrays, for CMP monitoring. The unique, noncontact NanoXam design uses low noise interferometry to measure both targets and actual device structures on product wafers, providing inline CMP process control.

According to Gartner Dataquest, as the semiconductor industry makes the transition from 130nm to 90nm and beyond, copper interconnects will penetrate the majority of logic devices and some of the memory segment, with overall copper use expected to rise from 14% to above 40% by 2007.

"Control of copper dishing and erosion is a serious challenge for advanced copper CMP process integration", stated Dr. Chris L. Koliopoulos, ADE's president and chief executive officer. "ADE's new NanoXam system is our first patterned wafer noncontact metrology system that can be used on product wafer device structures, not just isolated target structures. This unique three-dimensional mapping capability allows CMP process engineers to quickly improve their process and statistically monitor production for improved yield. NanoXam surface topography data can also indicate when the slurry chemistry needs adjustment, or polishing pads require maintenance, increasing the quality and effectiveness of the copper planarization process."

The NanoXam system, designed for 200mm or 300mm copper CMP processes, provides stable step-height analysis, robust pattern recognition, and 3-D surface topography maps. The system measures both targets and actual device structures rapidly allowing multiple die sampling to monitor process non-uniformity within-wafer and wafer-to-wafer. This fast data acquisition capability, along with NanoXam's non-contact surface topography measurement, provides users a high value statement and lower cost of ownership when compared to traditional stylus contact profilometry, which can potentially damage product device structures.

ADE is demonstrating the new NanoXam inline copper metrology system, as well as its full line of silicon wafer inspection and metrology tools and semiconductor process control systems, at Semicon West, July 12 -14, Moscone Center, South Hall, Booth 1302, in San Francisco.

About ADE Corporation

ADE Corporation is a leading supplier of metrology and inspection systems required for production in the silicon wafer, semiconductor device, magnetic data storage and optics manufacturing industries. The Company's systems analyze and report product quality at critical manufacturing process steps for yield enhancement, providing quality certification data that is relied upon by semiconductor wafer, device and computer disk manufacturers. The Company's systems also are used for production measurements in the semiconductor chip fabrication process. To learn more about ADE, visit the Company's Web site at http://www.ade.com.