ADE Rolls Out its Next-Generation Wafer Inspection Tool; WaferXam System Delivers High Sensitivity and Superior Defect Classification at Production Throughputs.

WESTWOOD, Mass. -- ADE Corporation (Nasdaq: ADEX) today announced the WaferXam(TM), ADE's latest-generation nano-particle inspection and defect classification tool. This advanced darkfield laser scanning system is used for inspection of prime silicon substrates at semiconductor incoming quality control and silicon wafer suppliers, where advanced design rules require more real-time measurement and inspection for cost-effective process control. The WaferXam tool features a new system design, utilizing enhancements to ADE's patented Angle Resolved Scatter architecture, for highly improved defect detection sensitivity and classification performance.

Positioned to serve the 45nm process development market and exceed the requirements for 65nm wafer production, the flexible WaferXam platform offers a high-sensitivity mode with 33nm defect detection to meet tightening customer specifications, with production throughputs in excess of fifty 300mm wafers per hour. New classification algorithms, combined with increased defect sensitivity, result in more yield-killing defects detected and binned in real time for higher yields and faster process feedback.

"Device yield starts with the bare silicon wafer," stated Paul Hofemann, ADE's vice president of marketing and business development. "At the 65nm node and below, minute substrate flaws, once considered trivial, have become defects that impact device yield. These new defects must be captured with enough signal discrimination to be sorted real-time into useful classification bins that expedite root cause corrective action. ADE's proven, superior defect inspection technology is providing the critical data for fab managers and engineers to better manage their incoming silicon to optimize their device yield performance."

"Effective process control requires high confidence, real-time defect classification," added Hofemann. "ADE's WaferXam system uses a unique darkfield angular resolved scatter technology that leverages the advanced optics architecture for superior defect detection and classification, without costly and time-consuming manual review. The process engineer working on advanced 45nm R&D or 65nm production now has the ability to detect and classify in real-time the new nanoscale yield-limiting defects, while avoiding benign defect distractions."

ADE's WaferXam system, for 300mm and advanced 200mm wafer production, features non-contaminating edge grip handling and full factory automation wafer production. WaferXam tools integrate seamlessly with ADE's new FabVision(TM) fab-wide data management and yield improvement system.

ADE will be highlighting the performance benefits of the new WaferXam and FabVision systems, as well as its full line of semiconductor wafer inspection, metrology tools and yield management systems, at Semicon West, July 12-14, Moscone Center, South Hall, Booth 1302, in San Francisco.

About ADE Corporation

ADE Corporation is a leading supplier of production process control and quality certification systems for the semiconductor device, silicon wafer, magnetic data storage, and optics manufacturing industries. The Company's systems measure and inspect a variety of bare silicon and patterned wafers for dimensional parameters, surface defects, particles, and process non-uniformities, analyzing and reporting product quality at critical manufacturing process steps for yield enhancement. To learn more about ADE, visit the Company's Website at http://www.ade.com.