A T M I's Epitronics Business Selected as Raytheon Primary Supplier.Business & High-Tech Editors DANBURY, Conn. and ANDOVER, Mass.--(BUSINESS WIRE)--Jan. 12, 2000 Epitronics To Supply InGaP HBT HBT Heterojunction Bipolar Transistor HBT HyCult Biotechnology (Uden, The Netherlands) HBT Hanbury-Brown-Twiss (interferometer) HBT Herring Bone Twill HBT Heflex Bioengineering Test Epi Wafers for Raytheon RF Components A T M I, Inc. (Nasdaq: ATMI ATMI American Textile Manufacturers Institute ATMI Association for Technology in Music Instruction ATMI Advanced Technology Materials, Inc. ATMI Application-to-Transaction Manager Interface ATMI According to My Information ATMI Atm Interface Unit ), today announced that Raytheon RF Components selected A T M I's Epitronics business to be its primary supplier of Indium Gallium Phosphide Indium gallium phosphide (InGaP) is a semiconductor composed of indium, gallium and phosphorus. It is used in high-power and high-frequency electronics because of its superior electron velocity with respect to the more common semiconductors silicon and gallium arsenide. (InGaP) emitter Heterojunction Bipolar Transistor The heterojunction bipolar transistor (HBT) is an improvement of the bipolar junction transistor (BJT) that can handle signals of very high frequencies up to several hundred GHz. It is common in modern ultrafast circuits, mostly radio-frequency (RF) systems. (HBT) epitaxial wafers. Use of HBT devices is critically important for making components that improve wireless communications wireless communications System using radio-frequency, infrared, microwave, or other types of electromagnetic or acoustic waves in place of wires, cables, or fibre optics to transmit signals or data. equipment performance. Using InGaP materials enhances the benefits of HBTs over more typically-used materials such as Aluminum Gallium Arsenide An alloy of gallium and arsenic compound (GaAs) that is used as the base material for chips. Several times faster than silicon, it is used in high frequency applications such as cellphones, DVD players and fiber optics. (AlGaAs). Dr. Timothy Murray, General Manager of Epitronics', III-V division, the A T M I unit responsible for providing the wafers to Raytheon, said, "Epitronics is a leading proponent for the use of these materials for cellular and other wireless communications devices. The fast-growing wireless communications markets are demanding smaller, more capable, highly reliable components. We've worked with several companies from initial research to commercial ramp up Ramp Up To increase a company's operations in anticipation of increased demand. Notes: A company might 'ramp up' operations if they just signed a contract creating substantially more demand for their product. See also: Demand, Economies of Scale . Raytheon is one of the first to publicly announce the availability of parts based on these advanced technologies." Phil Yin, President of Epitronics said, "We are especially pleased to be chosen the primary InGaP HBT epitaxial wafer supplier to Raytheon RF Components. Their distinguished record translating high performance technologies developed for space and defense applications into cost-effective consumer wireless applications mirrors Epitronics', expertise in translating advanced semiconductor materials Semiconductor materials are insulators at absolute zero temperature that conduct electricity in a limited way at room temperature (see also Semiconductor). The defining property of a semiconductor material is that it can be doped with impurities that alter its electronic properties from the laboratory into commercial-quality, volume production." Dave Laks, Raytheon RF Components Director of Marketing and Sales, said, "HBT-based components provide cost-effective design solutions to cell phone makers and other wireless communication device applications. Our customers and design teams now have access to the advantages provided by our series of components based on our InGaP emitter HBT technology -- excellent performance, enhanced reliability, and potentially smaller chips. Our customers rely on the quality and performance of the products we sell them. The performance and reliability of the HBT-based devices Raytheon RF Components ships depend, to a significant degree, on the type of advanced semiconductor epitaxial wafers provided by Epitronics. Epitronics has demonstrated the ability to deliver the required quality reproducibly and cost effectively." Raytheon Company is a global technology leader that provides products and services in the areas of commercial and defense electronics, engineering and construction, and business and special mission aircraft. Raytheon has operations throughout the United States United States, officially United States of America, republic (2005 est. pop. 295,734,000), 3,539,227 sq mi (9,166,598 sq km), North America. The United States is the world's third largest country in population and the fourth largest country in area. and serves customers in more than 80 countries. Epitronics, part of A T M I Technologies, is a leading supplier of specialty epitaxial services to the semiconductor industry. Epitronics' Silicon Division in Mesa, AZ provides silicon epitaxial services for thin film growth of single layers on buried layers and patterns, and advanced device structures. The III-V Division, in Phoenix, AZ provides III-V epitaxial products used in wireless communications, satellites, and optoelectronics. A T M I provides products and services for semiconductor device manufacture through its Materials and Technologies units. A T M I Materials includes thin film materials and delivery systems, sub-atmospheric gas delivery systems, high-purity materials packaging systems, and photolithography A lithographic technique used to transfer the design of circuit paths onto printed circuit boards as well as the circuit paths and electronic elements of a chip onto a wafer's surface. A photomask is created with the design for each layer of the board or wafer (chip). and chemical-mechanical polishing materials. A T M I Technologies includes process and environmental solutions, thin film deposition Placing thin films of material onto metal, ceramic or semiconductor substrates. See sputtering. services, smart card solutions, and other ATMI ventures. Statements which are not historical information are forward looking, and involve risks and uncertainties, including, but not limited to: changes in semiconductor industry growth or A T M I's markets; competition, problems, or delays developing and commercializing new products; problems or delays in integrating acquired operations and businesses into A T M I; and other factors discussed in A T M I's filings with the Securities and Exchange Commission. Such risks and uncertainties could cause actual results to differ from those projected. http://web.atmi.com |
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