A Look at the Key Technologies and Business Opportunities for Businesses within the IC Packaging and Interconnection Industry.DUBLIN, Ireland -- Research and Markets (http://www.researchandmarkets.com/reports/c34278) has announced the addition of IC Packaging and Interconnection in·ter·con·nect v. in·ter·con·nect·ed, in·ter·con·nect·ing, in·ter·con·nects v.intr. To be connected with each other: The two buildings interconnect. v.tr. 2005-2010: Key Emerging Packaging and Interconnection Technologies to their offering. Why is this study so important? --This report summarises the major IC packaging, module and substrate The base layer of a structure such as a chip, multichip module (MCM), printed circuit board or disk platter. Silicon is the most widely used substrate for chips. Fiberglass (FR4) is mostly used for printed circuit boards, and ceramic is used for MCMs. trends. Rigid both, organic and ceramic This article is about ceramic materials. For the fine art, see Ceramic art. The word ceramic is derived from the Greek word κεραμικός (keramikos). , as well as and Flex A development system for Flash-based applications from Adobe. Introduced in 2004 as a J2EE application, Flex compiles ActionScript code and XML-based user interface descriptions (MXML) into binary Flash files (SWF files). substrate trends are included. --The IC packaging and thin core substrate market is a major business opportunity for substrate manufacturers, IC packaging houses, material suppliers and chemical suppliers. --This report presents a comprehensive review of the key technologies, applications and business opportunities for all companies in the interconnection and packaging supply chain. The major questions that are answered by this report: --What are the key systems requiring new and improved IC packaging and substrate technologies? --What are the growth drivers for the use of IC packaging and substrates? --What are the key emerging leading edge IC packaging and advanced substrate technologies? --What are these new technologies strengths, weaknesses, opportunities and threats? --What will be some the winning technology and market strategies for suppliers up to 2010? --What are the differences in the technological approaches adopted by different suppliers in different world regions? --How will the development of electronic systems impact upon future requirements for high-speed and advanced area array IC packages and PCBs? --What are the current and forecasted worldwide market opportunities for IC packaging and substrates for suppliers? --Which market sectors will experience the most growth in the next five years? Study Background This study presents an up to date current assessment and future forecast of how the dynamic market segment of electronics interconnection and packaging will evolve over the period 2005 to 2010 will evolve. The research program involved interviewing substrate suppliers, end users, EMS and ODM (Original Design Manufacturer) A contract manufacturer that uses its own designs and intellectual property (IP). See contract manufacturer. companies, materials and process equipment developers. In addition proven and reliable forecasting techniques were used to predict the future structure and size of this exciting sector. Topics Covered 1. INTRODUCTION 2. EXECUTIVE SUMMARY --Introduction --Electronic Systems --IC Packaging Substrates 3. REVIEW OF THE NEED FOR CORELESS AND THIN CORE SUBSTRATES - Introduction - Mobile Phones - Notebook Computers A laptop computer that weighs in a range from five to seven pounds. The term originated when laptops were routinely more than 10 pounds, and those that became lighter were placed in a special "notebook" category. In practice, notebook computer and laptop computer are synonymous. - High-end Servers - Wireless Base Station 4. IC PACKAGING AND MODULES --Introduction --IC Packaging --Ceramic Modules 5. PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. MARKET AND TECHNOLOGY TRENDS --Introduction --Rigid PCB Technology Trends --High Performance Substrates --Microvia and Build-Up build·up also build-up n. 1. The act or process of amassing or increasing: a military buildup; a buildup of tension during the strike. 2. Board Technology and Markets --Flex Production and Markets 6. CONCLUSION AND OPPORTUNITIES --Summary --Emerging Opportunities GLOSSARY A term used by Microsoft Word and adopted by other word processors for the list of shorthand, keyboard macros created by a particular user. See glossaries in this publication and The Computer Glossary. APPENDIX 1 APPENDIX 2 For more information visit http://www.researchandmarkets.com/reports/c34278 |
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