3M to Participate in DesignCon 2004 Technical Presentations on Chip Package Materials, Technologies.Business Editors/High-Tech Writers DesignCon 2004 AUSTIN, Texas--(BUSINESS WIRE)--Feb. 2, 2004 The 3M Electronic Solutions Division will participate in presentations on chip packaging and advanced materials Advanced Materials is a leading peer-reviewed materials science journal published every two weeks. Advanced Materials includes Communications, Reviews, and Feature Articles from the cutting edge of materials science, including topics in chemistry, physics, at DesignCon 2004 in Santa Clara Santa Clara, city, Cuba Santa Clara (sän`tä klä`rä), city (1994 est. pop. 217,000), capital of Villa Clara prov., central Cuba. , Calif. The electronics show and conference will take place Feb. 2-Feb. 5, at the Santa Clara Convention Center. The TecForum "TF9: Thin and Very Thin Laminates for Power Distribution: What is New in 2004?" will take place Feb. 2 from 1 p.m. to 4 p.m. William M. Balliette, manager, new business development, 3M Electronic Solutions, will present information on a new innovative 3M laminate laminate, n a thin slice of porcelain or plastic fabricated in a dental lab, which is cemented to the front of the teeth to cover gaps, whiten stained teeth, or reshape chipped or broken teeth. material that allows designers and manufacturers of high-speed digital printed circuit boards to achieve higher speeds while simplifying design tradeoffs. The 3M embedded capacitor material is used in a multilayer PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. to connect other layers in a multilayer PCB, thus the 3M embedded capacitor material effectively becomes a decoupling capacitor A decoupling capacitor is a capacitor used to decouple one part of an electrical network (circuit) from another. Noise caused by other circuit elements is shunted through the capacitor reducing the effect they have on the rest of the circuit. inside the board. The material allows designers to eliminate large numbers of decoupling capacitors, increases useable board area, enables faster signaling, lowers radiated emissions (EMI (ElectroMagnetic Interference) An electrical disturbance in a system due to natural phenomena, low-frequency waves from electromechanical devices or high-frequency waves (RFI) from chips and other electronic devices. Allowable limits are governed by the FCC. ), and saves engineering time associated with power distribution design and board layout. Printed circuit board fabricators can use the material in military, automated test equipment, computer and telecommunications applications. "Integrating 10G Serial onto a Large Digital CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. ASSP (Application Specific Standard Part) An ASIC chip that is designed as a generic device for a particular market. Whereas an ASIC is typically used only by its creator, ASSPs are used by many different companies in the design of their products. See ASIC. : Taking 10G from Lab to Production" is the title of a joint paper by Cortina cor`ti´na n. 1. (Biology) a cobwebby remnant of the partial veil which in some mature mushrooms hang from the edges of the cap. Noun 1. Systems and 3M and will be presented Feb. 4 from 8:30 a.m. to 9:15 a.m. The paper discusses the successful integration of 10G Serial I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output. I/O - Input/Output onto a large integrated CMOS ASSP chip. 3M provides the multilayer IC substrate/package. The 3M and Cortina Systems collaboration resulted in a high-performance package and design guidelines that allows the package to interface with a low-cost, standard FR-4 PCB and enables high speeds at a lower cost. George Hare, 3M product development specialist dealing with high-frequency/high-data-rate electrical modeling and simulation, contributed to the paper. About 3M Electronic Solutions Division 3M Electronic Solutions, part of 3M Company, has numerous technologies and provides a wide range of products for the electronics market. It provides flexible and multilayer microinterconnect packaging solutions; copper and fiber connectors, cables, and assemblies; static control products; tape and reel transport media for passive, semiconductor and electro-mechanical components; and test and burn-in sockets. More information on 3M Microinterconnect Products is available on the Internet at http://www.3M.com/microinterconnect. About 3M -- A Global, Diversified Technology Company Every day, 3M people find new ways to make amazing things happen. Wherever they are, whatever they do, the company's customers know they can rely on 3M to help make their lives better. 3M's brands include icons such as Scotch, Post-it, Scotchgard, Thinsulate, Scotch-Brite, Filtrete, Command and Dyneon. Serving customers in more than 200 countries around the world, the company's 67,000 people use their expertise, technologies and global strength to lead in major markets including consumer and office; display and graphics; electronics and telecommunications; safety, security and protection services; health care; industrial and transportation. For more information, including the latest product and technology news, visit www.3M.com. 3M, Scotch, Post-it, Scotchgard, Thinsulate, Scotch-Brite, Filtrete, Command and Dyneon are trademarks of 3M. |
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