3M Optimizes Package Designs for Noise Performance.Business Editors & Technology Writers AUSTIN, Texas--(BUSINESS WIRE)--Feb. 11, 2002 As signal transition times decrease and die become more dense, the selection of a first level interconnect package becomes increasingly relevant to system noise budgets. New research from 3M shows the effects of several design factors in flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. (FCBGA FCBGA Flip Chip Ball Grid Array FCBGA Flip Chip Bga ) organic laminate substrate design on simultaneous switching output noise (SSO See single sign-on and CSO. SSO - single sign-on noise). Evaluated optimizations include reduced SSO noise in a seven- versus five-layer substrate. This information is useful for system designers in the selection of the appropriate first level interconnect packaging substrate. An analysis of the trade-off decisions made during substrate design and the choice of cross-section in 3M's organic laminate substrates with respect to SSO noise performance will be presented by Colleen Fox at the ICAPS ICAPS Interactive Computer-Aided Provisioning System ICAPS Interactive Computer Aided Provisioning System ICAPS Internal Control Audit Planning Summary ICAPS Integrated Command Antisubmarine Warfare Prediction System ICAPS Integrated Carrier Acoustic/ASW Prediction System meeting in Reno, Nevada, on March 11. The effects of first-level interconnect cross-section and design rule selection will be compared using measured SSO noise levels. Written by Fox and David Hanson David Hanson can refer to
Variables in package design including via placement, package cross-section, signal length, routing density and routing layer are examined with respect to the significance of their effect on SSO noise levels. Maximum SSO noise measurements and SSO noise profiles of specific bits are demonstrated and related back to substrate features. Interactions between switching state and design factors are examined. For more information, contact 800-770-0710. To learn more about microelectronic packages from 3M, go to www.3M.com/microflex or stop by 3M's exhibit at ICAPS. 3M Microelectronic Packaging, headquartered in Eau Claire, Wisconsin Eau Claire is a city located in west-central Wisconsin. The population was 61,704 at the 2000 census. It is the county seat of Eau Claire CountyGR6, although a small portion of the city lies in neighboring Chippewa County. , provides high density multilayer interconnects for IC and opto-electronic packaging. High-density laminated chip packages provide breakthrough density and outstanding electrical performance optimized for ASICs in high bandwidth and networking applications. About 3M 3M is a $16 billion diversified technology company with leading positions in health care, safety, electronics, telecommunications, industrial, consumer and office, and other markets. Headquartered in St. Paul, Minnesota, the company has operations in more than 60 countries and serves customers in nearly 200 countries. 3M businesses share technologies, manufacturing operations, brands, marketing channels and other important resources. 3M is one of the 30 stocks that make up the Dow Jones Industrial Average Dow Jones Industrial Average The best known U.S. index of stocks. A price-weighted average of 30 actively traded blue-chip stocks, primarily industrials including stocks that trade on the New York Stock Exchange. and also is a component of the Standard & Poor's 500 Index. For more information about 3M go to www.3M.com or www.3M.com/profile/pressbox/index.jhtml. 3M is a trademark of 3M company |
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