3DSP Now Offers an Advanced Audio IP Suite for Embedded Applications Using Its SP-3 or SP-5 DSP Cores.

Business Editors & High Tech Writers

IRVINE, Calif.--(BUSINESS WIRE)--April 2, 2001

3DSP Corp., the leader in configurable, scalable digital signal processor (DSP) architectures, now offers an advanced intellectual property (IP) suite for embedding audio functionality in devices like next generation Internet appliances, portable audio players, set-top boxes and automotive audio systems.

Designed to speed system-on-chip (SoC) development of fully functional 16-bit digital audio subsystems based on 3DSP's SP-3(TM) and/or SP-5(TM) DSP cores with DSP-Shuttle(TM) Bus Controller, the new 3DSP Audio Software Suite significantly reduces final product cost in terms of both silicon and development time and effort.

In order to minimize silicon cost, the Audio IP Suite includes extended instructions specifically tailored for audio applications that eliminate the need for a companion microprocessor or microcontroller and reduce the size of the target silicon chip without sacrificing performance.

To reduce development time and effort, a comprehensive audio firmware library is provided, including complete decode facilities for MPEG Layer I and II, MP3, AC-3 and AAC audio standards and a complete package of post processing capabilities for sample rate conversion, equalization, reverb and other audio quality improvement functions.

"We believe that our new Audio IP Suite provides an ideal solution for developing the low-cost, high-performance audio subsystems required for next generation systems," said H. D. Boesch, vice president for marketing at 3DSP. "Since the Suite can be used with either of our powerful DSP cores, it offers exceptional design flexibility in order to match processor performance and power consumption requirements with an application while accommodating rapidly changing audio standards.

"It also allows design teams to develop scalable solutions across a performance and power consumption range with a single development effort."

The extended audio instruction sets for SP-3 and SP-5 cores utilize a 32x32 multiplier/accumulator for maintaining data integrity during audio encoding/decoding, and full conditional branching facilities for managing buffers and data flow. All of these additional instructions are supported within 3DSP's SPEEDi(TM) real-time operating system (RTOS), as well as an efficient C compiler that facilitates code reuse across both DSP platforms.

Simulation and debugging of audio application firmware using the 3DSP Audio IP Suite is supported by the company's GUI-based Software Studio(TM). Also included is a comprehensive, cycle-accurate simulator that simulates the core, the DSP-Shuttle Bus Controller, and many peripherals with extensive facilities for break pointing and file handling to speed debugging and verification tasks.

A range of silicon synthesizing and targeting options is also supported to get designs to target foundries with first-time-to-silicon success.

Licensing fees for the new 3DSP Audio IP Suite begin at $20,000 and depend on the capabilities selected for a particular application. A wide range of customized packages for support by 3DSP experts is also available.

About 3DSP

3DSP is a leader in implementing advanced digital signal processing solutions in silicon for embedded systems. The company offers the industry's only fully configurable DSP architecture, backed by a comprehensive object-oriented design environment and application-based intellectual property to speed complex system-on-a-chip (SoC) implementations to silicon with first time success. 3DSP's capabilities are used by Internet, broadband, wireless and multimedia designers to implement their next generation products.

For more information on the company and its products, visit www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon Road, Irvine, CA 92618 (phone: [phone]; fax: [phone]).

3DSP Corp., 3DSP, SP-3, SP-5, DSP-Shuttle, SPEEDi, Software Studio, and HiFI are trademarks of 3DSP Corp.