3DSP's Highly Optimized Voice-Over-Packet -- VoP -- Software Suite Sets New Performance Standards for Packet Telephony Systems.

Business Editors

IRVINE, Calif.--(BUSINESS WIRE)--June 4, 2001

3DSP Corp.(TM), the leader in configurable digital signal processor (DSP) architectures, now offers an extensive voice-over-packet (VoP) software suite that sets new performance standards for DSPs in next-generation packet telephony.

"Packet telephony is expected to become the fastest-growing market segment for semiconductors over the next decade," said Tom Beaver, CEO and president at 3DSP(TM). "Our new VoP Software Suite combined with our advanced DSP cores will enable silicon and systems companies to design DSP-based solutions for a wide range of emerging packet voice telephony equipment. At the high end, our technology will be able to provide the processing power to manage several hundred phone lines on a single chip, setting a new standard for cost effectiveness that will drive the convergence of communications."

The new VoP Software Suite complements 3DSP's portfolio of DSP and peripheral cores for developing SoC solutions appropriate for a wide range of products in the fast-growing VoP market.

The software is optimized for 3DSP's proprietary DSP architecture and supports all DSP processing requirements from Customer Premise Equipment (CPE) and residential gateways through media gateways and next-generation switches.

3DSP believes that its new packet voice software significantly outperforms other similar competitive offerings currently on the market.

For example a 128ms G.168-2000 compliant line echo canceller included in the suite takes less than 3 million processor cycles per second, and a G.726 speech coder takes just 3.5 million processor cycles per second for both encode and decode.

In both cases, such performance is more than twice as fast as that achieved by the most popular DSPs currently used in this application area. Other speech coders provided in the suite offer similar performance improvements.

"We are employing proprietary packet-voice-specific instructions to achieve lightning-fast speech coder algorithm execution," explained H. D. Boesch, vice president of marketing at 3DSP. "Ultimately, this allows our cores to handle more voice lines at the same clocking frequency than other competitive DSPs, leading to denser multi-channel VoP ICs handling more lines per chip than ever before. Such advances in performance and channel density can become a real differentiating factor in designing VoP equipment for use in space-constrained central offices, and at the same time can enable the design of lower-cost products in other packet voice applications."

For consumer applications, a low-power, minimally configured 3DSP core and routines from the VoP Software Suite can completely support the four channels of voice required for packet cable solutions.

Similarly configured single core/software designs can be implemented for other multi-channel CPE products.

For high-density solutions, a single 3DSP SP-5(TM) core can support over 80 complete voice channels when using the G.711 speech coder, including 128ms of echo cancellation and RTOS overhead. A multi-core, single chip solution can be created to support DS3 interconnectivity using common CMOS fabrication processes.

The new 3DSP VoP Software Suite offers a range of fully optimized building blocks for use with 3DSP cores including:

-- Innovative Voice Activity Detection and Comfort Noise Generation algorithms,
providing voice detection and silence suppression to cut down the packet
loading significantly while preserving voice quality in even the noisiest
environments;

-- An innovative jitter handler and lost frame interpolator which automatically
smoothes jitter and corrects for packet loss to further ensure high voice
quality;

-- A highly optimized ITU G.168-2000 compliant line echo canceller;

-- A robust DTMF capability for touch tone generation and detection;

-- A complete set of speech coders to accommodate G.711, G.723.1A, G.726, G.728
and G.729 A/B/E/G industry standards, among others;

-- A 3DSP SPEEDi(TM) real-time operating system;

-- System architecture support, controller interfaces, and other materials are
available.

Licensing fees for the new 3DSP VoP Software Suite begin at $20,000. A wide range of customized packages for support by 3DSP experts is also available.

About 3DSP Corp.

3DSP is a leader in implementing advanced digital signal processing solutions in silicon for embedded systems. The company offers the industry's only fully configurable DSP architecture, backed by a comprehensive object-oriented design environment and application-based intellectual property to speed complex system-on-a-chip (SoC) implementations to silicon with first-time success.

3DSP's capabilities are used by Internet, broadband, wireless and multimedia designers to implement their next-generation products. For more information on the company and its products, visit www.3dsp.com or contact 3DSP headquarters at 16271 Laguna Canyon Road, Irvine, CA 92618 (phone [phone]; fax [phone]).

Note: 3DSP Corp., 3DSP, SP-5 and SPEEDi, are trademarks of 3DSP Corp.