2003 FSA Suppliers Expo Exhibitor Profiles.

Business Editors/High-Tech Writers

2003 FSA Suppliers Expo

SAN JOSE, Calif.--(BUSINESS WIRE)--Oct. 9, 2003

The Fabless Semiconductor Association's (FSA) 2003 Suppliers Expo takes place Oct. 9 at the San Jose McEnery Convention Center in San Jose, Calif. For in-depth information about the event visit http://www.fsa.org/suppliers_expo/.

Below are profiles from 2003 Suppliers Expo exhibitors. News releases and advisories are available at http://www.tradeshownews.com, Business Wire's trade show and conference news resource. Business Wire is the official news wire service for FSA's 2003 Suppliers Expo.

Company:  1st Silicon America, Inc
Booth:  412
Media Contact:  S.C. Sia
Phone:  [phone] During Show: 408-943-8131
E-Mail:  [e-mail]
Company URL:  http://www.1stsilicon.com or http://www.1si.com

Product Description: 1st Silicon (1Si) focuses on niche market
technologies by offering reliable and cost-effective embedded
non-volatile memory processes targeting a wide range of products such
as microcontrollers, smart cards, CMOS color image sensors, DSP-based
products, communications and automotive applications. Please visit
1Si's homepage at www.1si.com for more information.

Company Description: 1st Silicon (1Si), Malaysia's premier foundry
established in 1998 is headquartered in Kuching, Sarawak. 1Si started
production of 0.25um in 2001 and 0.18um in 2003. 1Si will be offering
0.25um embedded flash technology in 2004. 1Si has a capacity of more
than 40,000 wafers per month when fully ramped. 1Si also has its Sales
Office in the US and Taiwan.

Company: Analog Bits Inc.
Booth: 347
Media Contact: Mahesh Tirupattur
Investor Relations Contact: Mahesh Tirupattur
Phone: [phone]
E-mail: [e-mail]
Company URL: www.analogbits.com

Product description: Analog Bits specializes in designing analog
IP components fully customized for easy and reliable integration into
digital chips designed on standard CMOS logic processes. Products
include PLL compiler, application specific PLL's, high speed interface
with integrated PHY technology, high speed SRAM's, CAM's and
specialized library components.

Company description: Analog Bits, Inc. was founded in 1995 and is
headquartered in Silicon Valley, California. Analog Bits, is a
privately funded company, and has been profitable every quarter since
its incorporation in 1996. With over 100 designs that have used our
IP, we have had an excellent track record of "first time working
silicon" at TSMC, UMC, IBM and IDMs.

Company:  Artest Corporation
Booth:  348
Media Contact:  [e-mail]
Investor Relations Contact:  [e-mail]
Phone:  [phone]
E-mail:  [e-mail]
Company URL:  http://www.artest.com

Product description: Artest has a series of testers ranging from
Teradyne, Credence, Schlumberger, and Agilent at its Sunnyvale and San
Diego sites. Along with testers, Artest engineers support the total
turnkey solution by designing loadboards and probecards, generating
test programs, and implementing final test.

Company description: Artest Corporation is a world-class provider
of backend test services. These services include program development,
production test, and manufacturing management. The company's area of
expertise addresses the most complex testing and manufacturing
challenges such as mixed-signal, radio frequency (RF) and high-end
digital integrated circuit (IC) technologies.

Company: Aspen Technologies
Booth: 229
Media Contact: Scott Brown
Investor Relations Contact:  Jack Harrison
Phone: [phone]
E-mail: [e-mail]
Company URL:  http://www.aspentechnologies.net

Product description: Aspen Technologies specializes in world-class
packaging of I.C.s, MEMS, photonics and biomedical devices. Services
include wafer dicing, finest-pitch wirebonding, flip chip, and
hermetic and controlled environment sealing. Competitive prices with
24-hour quick-turns available. ISO 9001:2000 certified. Visit our web
site at www.aspentechnologies.net.

Company Description: Founded in 1995 in Colorado Springs, Aspen
Technologies began providing semiconductor assembly services for
prototypes and design verification (DV) support to the integrated
circuit industry in Colorado. Aspen Tech has grown to a full-service
packaging foundry for the international semiconductor industry,
offering a wide variety of microelectronic packaging and assembly
processes.

Company: austriamicrosystems
Booth: 408/410
Media Contact: Jolyne Wagner
Investor Relations Contact: Wilfried Bair
Phone: [phone]
E-mail: [e-mail]
Company URL: http://www.austriamicrosystems.com/
Press Kit URL:
http://www.austriamicrosystems.com/07presscenter/presscenter_start.htm

Product description: austriamicrosystems is a full-service silicon
foundry specializing in analog mixed-signal, high-voltage and
high-frequency technologies. austriamicrosystems production core
process-technologies includes 0.35um and 0.80um CMOS, SiGe BiCMOS and
High-Voltage processes and is a qualified second source for selected
TSMC mixed signal processes. austriamicrosystems provides world class
quality standards and PDK support kits.

Company description: austriamicrosystems is one of the world's
leading designers and manufacturers of highly integrated mixed signal
ICs, combining more than 20 years of design capabilities, product and
marketing know-how with a full service silicon foundry.
austriamicrosystems is organized in four strategic business units:
Communications, Automotive, Industrial & Medical and Full Service
Foundry.

Company: Barcelona Design, Inc.
Booth: 531
Media Contact: Luciana Guarnieri; 510-897-1814;
[e-mail]
Investor Relations Contact: Michael Hasley; 510-897-1800;
[e-mail]
Company URL: www.barcelonadesign.com
Press Kit URL: http://www.barcelonadesign.com/news/press_kit.asp

Product Description: The Dali data converter engine is the world's
first data converter synthesizer. Dali allows rapid synthesis of
complex, high performance analog-to-digital and digital-to-analog
converters in CMOS technologies, breaking time-to-market bottlenecks
for mixed-signal SOCs. The first engine is a pipeline ADC product with
a range of 6-10 bits and up to 100 MSPS.

Company Description: Barcelona is the leading supplier of analog
synthesis solutions to semiconductor and systems companies. Our
solutions are based on a unique technology that replaces
trial-and-error simulation methods and enables the creation of
full-custom circuits from specifications to GDSII, in a matter of
hours. Barcelona's silicon-proven solutions significantly eliminate
time-to-market bottlenecks and dramatically improve return on assets.

Company: BindKey Technologies, A DuPont Photomasks Company
Ticker Symbol:    US:DPMI
Booth:   541
Media Contact:  Tom Daspit; 408-773-1206; [e-mail]
Investor Relations Contact:  Tom Blake; 512-310-6563;
[e-mail]
Company URL:  www.bindkey.com

Product description: BindKey's initial product, RapiDesignClean,
targets design rule compliance interactivity during the editing
process.

Company description: BindKey Technologies provides innovative
physical implementation solutions that enable nanometer design for
manufacture. Our tools work within existing design flows and enable
designers to assure manufacturability during the design process thus
improving design productivity, reliability, reducing costs, and
accelerating time to market.

Company: Chartered Semiconductor Manufacturing
Ticker Symbol: Nasdaq: CHRT
Booth: 102, 104
Media Contact: Tiffany Sparks
Investor Relations Contact: Suresh Kumar
Phone: [phone]
E-mail: [e-mail]
Company URL: www.charteredsemi.com
Press Kit url: www.charteredsemi.com/media/

Product description: Chartered announced deliverables for its
NanoAccess(TM) system-on-chip manufacturing technologies at the
90-nanometer (nm) node. NanoAccess offerings are based on the
semiconductor industry's process platform for 90nm being jointly
developed by Chartered and IBM. The design manual and SPICE models are
currently available to early adopters for design prototyping.

Company description: Chartered Semiconductor Manufacturing, one of
the world's top three silicon foundries, forges a customized approach
to outsourced semiconductor manufacturing by building lasting,
collaborative partnerships with our customers. Chartered provides
comprehensive wafer fabrication services and product offerings
addressing both the leading-edge requirements and complementary niche
technologies needed for today's SOC solutions.

Company: Chipworks
Booth: 426
Media Contact: Nick Farinaccio
Investor Relations Contact: Michael Thumm
Phone: [phone]
E-mail: [e-mail]
Company URL: www.chipworks.com

Product description: Chipworks reports are a cost-effective way of
acquiring instant competitive knowledge. Our reports provide a
detailed analysis of a single device; microchip or electronic system
and depending on the report format may include identification of major
components, analysis of the circuit design and fabrication techniques.

Company description: Chipworks analyzes the circuitry and physical
composition of semiconductors and electronic systems for a wide range
of applications in patent licensing support and competitive study. For
over 11 years, Chipworks has successfully helped leading-edge
semiconductor and electronics manufacturers, as well as start up
companies achieve their goals by supporting research and development
efforts in strategic product development and patent portfolio
management.

Company: DongbuAnam Semiconductor
Booth: 507
Media Contact: Elizabeth Estrella Basilio
Phone: [phone]
E-mail: [e-mail]
Company URL: http://www.dsemi.com


Product description: DongbuAnam Semiconductor provides world-class
CMOS wafer foundry services for Logic, Mixed-Signal, and Special
Technologies. Our state-of-the-art facilities are currently shipping
0.25-micron and 0.18-micron wafers and our 0.15-micron process is
production ready. In Q1 of 2004 DongbuAnam will begin production of
our leading-edge 0.13-micron Logic process, which features all copper
interconnects and low-k dielectrics. For more information, visit
http://www.dsemi.com.

Company description: DongbuAnam, the 4th largest pure-play
foundry, operates two CMOS wafer fabrication facilities within South
Korea's established semiconductor manufacturing infrastructure. Our
foundry compatible processes, along with an expanding portfolio of
silicon proven IP, provide customers with a solid foundation for
risk-free semiconductor manufacturing.

Company: eSilicon Corporation
Booth: 245
Media Contact: Mike Gianfagna
Investor Relations Contact: Mike Gianfagna
Phone: [phone]
E-mail: [e-mail]
Company URL: http://www.esilicon.com

Product description: eSilicon offers value-added design and
manufacturing expertise, with an e-business infrastructure that
provides visibility, predictability and time-to-market advantages to
its customers. eSilicon's unique and flexible approach manages every
step of the IC development process - from specification through
manufacturing, resulting in delivery of high quality, cost-effective,
packaged and tested parts.

Company description: eSilicon is a full service fabless custom
chip company with a business model that manages complexity, minimizes
risk and reduces cost for companies looking to design and manufacture
custom ICs. Customers are no longer subject to the captive hold of
traditional suppliers. eSilicon offers a different and better path.

Company: Fabless Semiconductor Association
Booth: 518
Media Contact: Vivian Pangburn
Phone: [phone] x140
E-mail: [e-mail]
Company URL: http://www.fsa.org
Press Kit URL: http://www.fsa.org/suppliers_expo/press.asp

Product description: Founded in 1994 to promote the fabless
business model, the FSA provides tools and resources to foster
successful companies. The FSA supports the semiconductor industry
through educational programs and events; publications and reports;
industry surveys; technology committees; and a comprehensive web site.

Company description: The FSA is the global voice of fabless and
fab-lite semiconductor companies and their foundry and supply chain
partners. The organization encourages the relationship between
semiconductor companies and suppliers; facilitates business
partnerships; creates awareness of the fabless/outsourced business
model; disseminates industry data; and fosters standards and policies.

Company: IBM Corporation
Ticker Symbol: IBM
Booth:  418
Media Contact:  Scott Sykes; 845-892-5023; [e-mail]
Company URL: www.ibm.com/chips

IBM develops, manufactures and markets state-of-the-art
semiconductor, ASIC and interconnect products and services. IBM offers
a comprehensive suite of foundry technologies ranging from
industry-standard CMOS and RF CMOS to high-performance silicon
germanium BiCMOS technologies. IBM's design kits, combined with its
relationships with IP providers, design centers and wafer service
providers, enables customers to design flexible solutions using IBM's
advanced technology. To complete a total product solution, IBM offers
a variety of packaging choices for your products. Visit the IBM booth
to learn more about IBM's technologies, services and business
partnerships.

Company:  Inovys Corporation
Booth:  533
Media Contact:  [e-mail]
Investor Relations Contact:  [e-mail]
Phone:  [phone] x 139
E-mail:  [e-mail]
Company URL:  http://www.inovys.com

Product description: Inovys FlopPlot is software for analyzing
semiconductor devices. It shows design/verification engineers
visualization of test results and transfers useful data to EDA
diagnostic tools from Cadence, Mentor, and Synopsys. Introduced at the
2002 International Test Conference, the Ocelot test system and desktop
Personal Ocelot received the 2003 Best in Test award.

Company description: Inovys Corporation supplies advanced test
solutions for semiconductor manufacturers who require economical
structured ATE systems and EDA-to-Test software. Inovys has pioneered
the low-cost desktop tester, which combines ATPG-ATE-EDA integration
with advanced failure analysis tools utilizing DFT methodology. Inovys
is headquartered in Pleasanton, CA, with offices in Austin, Texas.

Company: ISE-Integrated Systems Engineering
Booth: 545
Media Contact: Claudia Chan
Investor Relations Contact: Manuela Hutter
Phone: [phone]
E-mail: [e-mail]
Company URL: www.ise.com
Press Kit URL: [e-mail]

ISE is a world-leading provider of Technology CAD (TCAD) software
as well as simulation and consulting services. ISE's software and
services enable semiconductor companies to save time and resources
through the use of physics-based simulations to develop and optimize
semiconductor processing technologies and devices. Founded in 1993,
ISE is an international corporation with operations in Switzerland,
USA, Japan, Taiwan, China, Korea, and Singapore. For more information,
visit http://www.ise.com.

Company: Jazz Semiconductor
Booth: 529
Media Contact: Kerry Fedro
Investor Relations Contact: Jeff McHenry
Phone: [phone]
E-Mail: [e-mail]
Company URL: www.jazzsemi.com

Jazz Semiconductor, headquartered in Newport Beach, Calif.,
provides wafer foundry services based on world-class radio frequency
(RF) and mixed-signal process technologies for wireless
communications, optical networking and other high-performance
applications. The company's rich heritage in advanced, mixed-signal
and RF processes and circuit design has forged its strong position in
silicon germanium (SiGe), as well as RF CMOS and bipolar CMOS (BiCMOS)
technologies. Founded in March of 2002 when it spun off from Conexant
Systems, Inc., Jazz is a diversified supplier of integrated circuits
for a broad range of communications applications and is privately
held. Jazz's shareholders include the Carlyle Group, Conexant Systems,
Inc. and RF Micro Devices, Inc. (RFMD).

Company: Legend Design Technology, Inc.
Booth: 150
Media Contact:  Jane Wei
Phone:  [phone] X234
E-mail:  [e-mail]
Company URL:  www.LegendDesign.com
Press Kit URL:  www.LegendDesign.com/news.shtml

Product description: Legend's CharFlo-Memory!, MSIM and Turbo-MSIM
products revolutionize the process of characterization and simulation
for semiconductor IP in SoC designs.

CharFlo-Memory! provides automatic instance-based characterization
and verification for memory IP. MSIM, a high-accuracy circuit
simulator, delivers excellent price-performance. Turbo-MSIM is a
high-speed and high-capacity circuit simulator for complex IC designs.

Company description: Legend Design Technology, Inc. is a leading
provider of characterization and simulation software for semiconductor
Intellectual Property (IP) in SoC designs.

Legend is currently headquartered at Santa Clara, California with
distributors in Japan and Korea. To forge strong ties with
semiconductor foundries across the world, Legend has formed R&D and
support teams in Taiwan.

Company:  MIPS Technologies, Inc.
Ticker Symbol: MIPS, MIPSB
Booth: 440
Media Contact: Lee Flanagin
Investor Relations Contact: Bonnie Gardiner
Phone: [phone]
E-mail: [e-mail]
Company URL: http://www.mips.com
Press Kit URL: http://www.mips.com/content/PressRoom/

Product description: MIPS Technologies' offers a broad range of
products including 32- and 64-bit embedded microprocessor cores,
Instruction Set Architectures, System Controllers and Software tools
to offer maximum flexibility and convenience to meet a multitude of
market requirements; high performance, low power, low silicon cost and
accelerated time-to-market.

Company description: MIPS Technologies is the leading provider of
32- and 64-bit RISC processor architectures and cores for embedded
applications. Licensees of its technology -- semiconductor companies,
foundries and system OEMs -- form the broadest alliance of companies
delivering embedded RISC solutions. High-performance, low-power
MIPS-based products can be found in digital consumer, networking and
other applications.

Company:  PDF Solutions, Inc.
Ticker Symbol:  Nasdaq: PDFS
Booth:  124
Media Contact:  Jen Bernier
Phone:  [phone]
E-mail:  [e-mail]
Investor Relations Contact:  Rochelle Krause
Phone:  [phone]
E-mail: [e-mail]
Company URL:  www.pdf.com

Product description: New pDfx (demos in booth 124) provides PDF's
knowledge of IC manufacturability directly to designers for optimizing
designs for manufacturability before tape-out. It helps cut costs,
accelerate production ramps, and reduce the risk of re-spins. pDfx
works with IP from target processes and tools from Cadence, Magma, and
Synopsys.

Company description: PDF Solutions is the leader in process-design
integration technologies to enhance IC manufacturability. Its software
and services help semiconductor companies create designs that are more
manufacturable and more capable manufacturing processes. By simulating
IC product and process interactions, PDF offers customers faster
time-to-market and increased yield, performance, and reliability.
www.pdf.com.

Company:  Portelligent, Inc.
Booth:  148
Media Contact:  Don Stroudl; 512-338-3600, ext. 221;
[e-mail]
Phone:  [phone]
E-mail:  [e-mail]
Company URL:  www.teardown.com

Product description: Portelligent product teardown reports provide
detailed analyses of consumer electronic products including cell
phones, digital cameras, PDAs, wireless LAN gear, game machines, and
personal appliances. Each teardown report includes an executive
summary, complete specifications, power measurements, system block
diagram, teardown photo sequence, complete bill-of-materials,
manufacturing cost estimates, and system metrics.

Company description: Portelligent provides technology intelligence
through Product Teardowns and related technology analysis of
leading-edge consumer electronics products. Executives and
professionals involved with the mobile, wireless, and personal
electronics sectors from companies large and small, rely on
Portelligent to improve quality of decisions regarding competitive
positioning, technology options, and marketplace opportunities.

Company: QThink
Booth: 506
Media Contact: Tammy Wood
Phone: [phone]
E-mail: [e-mail]
Company URL: www.qthink.com

Product Description:
"Front-to-back" Semiconductor Chip Design Services including:
Semiconductor Chip Logic Design (Front End) -

-- Spec to RTL
-- RTL Simulation
-- Hierarchical Floorplanning
-- Synthesis
-- Formal Verification
-- Gate Level Simulation
-- Static Timing Analysis
-- Design For Test

Semiconductor Chip Physical Design (Back End) -

-- Physical Floorplanning
-- Place and Route
-- RC Extraction
-- Formal Verification
-- Physical Verification
-- Release to Manufacturing

Company Description: QThink offers front-to-back design solutions
to companies involved in wired/wireless communications, networking,
multimedia, computing, medical and military applications. QThink has
successfully completed many complex multi-million-gate chip designs
targeted to multiple deep sub-micron technologies. The company
implements the best solution for each customer, utilizing its advanced
knowledge and experience with leading EDA tools, libraries, and
foundry technologies, while protecting clients' product intellectual
property.

COMPANY: QUIK-PAK
BOOTH: 508
MEDIA CONTACT: JACQUES GLADU
INVESTOR RELATIONS CONTACT: JEANNE BEACHAM
PHONE: [phone]
E-MAIL: [e-mail]
COMPANY URL: www.quikicpak.com

PRODUCT DESCRIPTION: Quik-Pak's patented Open Cavity I.C. Plastic
Packages are the preferred choice for assembly of prototype I.C.
designs by leading semiconductor companies and the Fabless sector.
Strategically incorporating Quik-Pak's advantages into the design
program provides the most timely, cost effective solution for
qualification of new designs.

COMPANY DESCRIPTION: Quik-Pak provides unlimited open cavity
plastic package configurations. This patented technology is ideal for
Fabless companies who desire immediate testing results of new I.C
designs in plastic packages. Your prototypes can now be assembled in a
plastic package that is identical to the production part, both
mechanically and electrically. Complete turnkey service is available
in 24 hours or less.

Company:  Sagantec
Booth:  402
Media Contact: Phyllis Orlando or Ed Lee
Phone:  [phone]
E-mail: [e-mail]
Company URL: www.sagantec.com

Product description: See a demo of Anaconda(TM), the latest analog
layout acceleration tool that is tightly integrated into the
Cadence(R) Virtuoso(R) custom design platform. Learn how to migrate
your designs using SiClone(TM) and Companion(TM) compaction
technologies, and optimize them for manufacturing and yield using the
DRC fixing tool - SiFix(TM).

Company description: Sagantec is the leader in process migration,
compaction and custom IC layout acceleration. Sagantec develops
software that enables reuse of full-custom designs, including CPU,
memory and analog/mixed-signal circuits supporting 130 nm, 90nm and
65nm process design rules. As an active member in the OpenAccess
Coalition, Sagantec supports industry-wide interoperability.

Company: Silvaco International
Booth: 325
Media Contact: Ken Brock
Phone: [phone]
Company URL: www.silvaco.com

Product description: Silvaco delivers a comprehensive set of EDA
tools that enable companies to design analog and mixed-signal
integrated circuits. Semiconductor technology engineers use our TCAD
products to develop and optimize their semiconductor processes. IC
designers use our IC CAD products to design and simulate analog
circuits.

Company description: Silvaco International is a leading provider
of electronic design automation (EDA) software for analog and
mixed-signal integrated circuit design. Founded in 1984, the company
delivers proven products for TCAD process and device simulation, Spice
parameter extraction, circuit simulation, and custom IC
design/verification.

Company: SiVerion, Inc.
Booth: 328
Media Contact: David Karel
Investor Relations Contact: David Karel
Phone: [phone] x16
E-mail: [e-mail]
Company URL: www.siverion.com

Product description: The SiVisionT solution enables rapid,
comprehensive characterization of semiconductor products to ensure
manufacurability and provides automated monitoring through volume
production. The solution allows semiconductor companies to identify
chip design and manufacturing issues earlier which is critical to
delivering the right product to market on time, and at targeted profit
margins.

Company description: SiVerion provides a web-based interactive
engineering data analysis solution that accelerates semiconductor
company designs to volume production. The company has been helping
semiconductor companies accelerate designs to market since 1998 and is
dedicated to exploiting leading edge technologies to solve information
management and data analysis issues for the semiconductor industry.

Company:  Sycon Design, Inc.
Booth:  448
Media Contact:  Phyllis Orlando
Phone:  [phone]
E-mail:  [e-mail]
Company URL: www.sycon-design.com

Product description: Tempest IC Performance Platform is an
automated hierarchical physical design solution that achieves
aggressive chip performance goals. With silicon successes at 0.25,
0.18 micron and below, Tempest captures the simplicity of ASICs with
the benefits of full-custom design. This methodology does not require
design flow modification, resulting in increased design productivity.

Company description: Sycon Design provides a proven software
technology and optimization services that achieve next-generation
performance with today's manufacturing process to deliver highly
optimized integrated circuits. Complemented with comprehensive
physical design services (RTL - GDSII) and automated IC implementation
techniques, Sycon will maximize performance, optimize power
consumption, and produce the smallest chip area.

Company: Synopsys
Ticker Symbol: SNPS
Booth: 512
Media Contact: Eileen Hunt
Investor Relations Contact: Minaxi Patel
Phone: [phone]
Company URL: www.synopsys.com

Product description: Synopsys' best-in-class tools enables
designers to create and verify complex IC, ASIC, FPGA and SoC designs
from concept to silicon. Synopsys provides system-level to
silicon-level verification, a complete design and test environment,
design reuse technology, and professional services. Synopsys' products
improve performance, complexity, silicon area, cost, power consumption
and time-to-market.

Company description: Synopsys, Inc. (Nasdaq:SNPS) is the world
leader in semiconductor design software and also develops software
that companies use to design systems-on-chips (SoCs) and electronic
systems. The company sells its products to semiconductor, computer,
communications, consumer electronics, aerospace and other companies
that develop electronic products.

Company: Tanner EDA
Booth: 146
Media Contact: Liz Clinkenbeard
Phone: [phone]
E-mail: [e-mail]
Investor Relations Contact: Judy Bergstresser
Phone: [phone]
E-mail: [e-mail]
Company URL: www.tanner.com/eda

Product description: Tanner's L-Edit Pro(TM) and T-Spice Pro(TM)
provide a complete design flow including schematic entry, waveform
probing, full-custom layout editing, placement and routing, LVS and
DRC verification, netlist extraction and circuit simulation. L-Edit
Pro and T-Spice Pro offer unsurpassed capabilities in analog,
mixed-signal, MEMS and optical design on the Windows(R) platform.

Company description: Tanner EDA develops layout, verification and
simulation software for analog and mixed-signal IC, MEMS and
integrated optical designs on the Windows(R) platform. Tanner EDA is a
division of Tanner Research, Inc., a privately held company founded in
1988 and headquartered in Pasadena, California.

Company: The European Operation Ltd
Booth: 125
Media Contact: Adam Fletcher
Investor Relations Contact: Adam Fletcher
Phone: [phone]
E-mail: [e-mail]
Company URL: www.TheEuropeanOperation.com

The European Operation specialise in the specific "demand
creation" needs of Semiconductor "Start-Up's" for Full Service PR,
Marketing Communication and Business Management. Our focus enables
Semiconductor "Start-Up's" to successfully penetrate their target
customers in Europe quickly and cost effectively. We operate
seamlessly as your management team in Europe, who understand your
business needs and how to implement them.

Company:  Toshiba America Electronic Components, Inc.
Booth:  129
Media Contact: Deborah Chalmers (company) or Judith Kahn (agency)
Phone: [phone] (Deborah) or 650-948-8881 (Judith)
E-mail:  [e-mail] or [e-mail]
Company URL:  http://www.chips.toshiba.com
Press Kit URL:  http://www.SoCMosaic.toshiba.com

Product description: Toshiba, a leader in 130 and 90nm processes,
will exhibit SoCMosaic(TM) custom chip, a Soft IP Platform that
reduces time to market to as little as six months. It allows
customization of SoCs using commodity IP blocks and standardized bus
interfaces. Toshiba will also exhibit its TC280 SERDES test board.

Company description: Toshiba America Electronic Components, Inc.
is an independent operating company owned by Toshiba America, Inc., a
subsidiary of Toshiba, the third largest semiconductor company
worldwide in terms of global sales for the year 2002 according to
Gartner/Dataquest's Worldwide Semiconductor Market Share Ranking.
Toshiba is a world leader in advanced ASICs.

Company:  TriCN
Media Contact: Kimberly Hathaway; 415.989.0230; [e-mail]
Company URL:  http://www.tricn.com

TriCN is a leading developer of high- performance semiconductor
interface intellectual property (IP). The company provides a complete
portfolio of IP for maximizing data throughput on and off the chip,
ranging from a Base I/O library to multi-gigabit SerDes products. This
IP is designed for IC developers addressing bandwidth-intensive
applications in the communications, networking, data storage, and
memory space. Founded in 1997, TriCN's customers range from startup to
established fabless semiconductor and systems companies, including
Philips, General Dynamics, SGI, IBM, Cognigine, Internet Machines, and
Apple Computer. TriCN is based in San Francisco, California.
www.tricn.com.

Company:  True Circuits, Inc.
Booth:  548
Media Contact:  Georgia Marszalek
Phone:  [phone]
E-mail:  [e-mail]
Company URL:  www.truecircuits.com

Product description: True Circuits, Inc. offers a family of
standardized clock generator, deskew, low-bandwidth and
spread-spectrum PLLs and DDR DLLs. These high-quality, low-jitter,
silicon-proven hard macros are available for immediate delivery in a
range of frequencies, multiplication factors and functions in TSMC,
UMC and Chartered processes from 0.25 to 0.09 micron.

Company description: True Circuits develops and markets a broad
range of timing hard macros for ICs. TCI's robust state-of-the-art
circuits, methodical and proven design strategy, and its close
association with the world's leading silicon fabrication vendors,
allow it to quickly and reliably produce new and innovative timing IP
in a variety of advanced process technologies.

Company:  UMC
Ticker Symbol:  NYSE: UMC, TSE: 2303
Booth:  421
Media Contact:  Eileen Elam
Phone:  [phone]
E-mail:  [e-mail]
Investor Relations Contact:  Julian Chu
Company URL:  www.umc.com

Product description:  Foundry Services

Company description: UMC is a leading global semiconductor foundry
that manufactures advanced process ICs for applications spanning every
major sector of the semiconductor industry. UMC delivers cutting-edge
foundry technologies that enable sophisticated system-on-chip (SOC)
designs, including 90nm copper, 0.13um copper, embedded DRAM, and
mixed signal/RFCMOS. UMC is also a leader in 300mm manufacturing; Fab
12A in Taiwan is currently in volume production for a variety of
customer products, while Singapore-based UMCi is now in pilot
production. UMC employs over 8,500 people worldwide and has offices in
Taiwan, Japan, Singapore, Europe, and the United States. UMC can be
found on the web at http://www.umc.com.

Company: VeriSilicon, Inc.
Booth: 137
Media Contact: Gang Zhong
Investor Relations Contact: Wayne Dai
Phone: [phone] x 102
E-mail: [e-mail]
Company URL: www.verisilicon.com
Press Kit URL: www. verisilicon.com

Product description: VeriSilicon provides foundry specific and
silicon-proven Standard Design Platforms, including standard cell
libraries, IO cell libraries, and memory compilers. Our customers have
achieved first silicon success on multi-million gate SoC designs
including microprocessors and DSPs. VeriSilicon also provides design
service and turn-key services including design, manufacturing,
packaging, testing, and delivery.

Company description: VeriSilicon is a leading ASIC Design Foundry,
which is fabless and chipless. VeriSilicon provides standard design
platform, including standard cell libraries, IO cell libraries, and
memory compilers for emerging wafer foundries, such as SMIC, GSMC,
ASMC, and HHNEC, ranging from 0.15 to 0.6 um. VeriSilicon has
subsidiaries in US, China, and Taiwan.

Company:  ZFOUNDRY
Booth:  436/438
Media Contact:  Jamie Laughlin
Investor Relations Contact:  Konrad Herre
Phone:  [phone]  (at show 408-219-1853)
E-mail:  [e-mail]
Company URL:  www.zfoundry.com

Product description: Customer Process Transfer: Development and
improvement with a decade of experience utilizing standard ZFOUNDRY
modules to create custom processes like HV-CMOS with special implant,
DMOS with back metal, BiCMOS with epitaxy, and NMOS with EEPROM.
Standard Mixed-Signal Processes: Options include 0.8/0.6 um CMOS with
analog, high or low voltage, and embedded EEPROM.

Company description: ZFOUNDRY - Your first choice for outsourcing
mixed-signal, portable and power management IC production, with
cost-effective manufacturing based on advanced CMOS technology: HV,
LV, EEPROM, and bipolar options. ZFOUNDRY (part of ZMD AG, Germany)
also offers world-class process development and transfer services on
6-inch wafers down 0.6 um, with automotive qualification.