100 A V-I Chip Now Available From Vicor; Isolated POL Sine Amplitude Converter Raises the Bar to Greater Than 400 A/cubic inch.

ANDOVER, Mass. -- Vicor Corporation (NASDAQ:VICR) today has introduced the V048K015T100 V-I Chip(TM) Voltage Transformation Module(TM) (VTM). The first such product capable of 100 A, the VTM breaks records for speed, density and efficiency to meet the demands of advanced DSP, FPGA, ASIC, processor cores and microprocessor applications at the point of load (POL) while providing isolation from input to output. It delivers up to 100 A from a V-I Chip package less than 0.25 cubic inch in volume and responds in a fraction of one microsecond to no load-full load and full load-no load step changes. Optimized for very low output voltages at high currents, it boasts efficiency of 90% at 1.2 V/100 A, and better than 92% at 50 A. The VTM may be paralleled to deliver hundreds of amps at an output voltage settable from 0.8 to 1.6 Vdc.

As a point-of-load current multiplier (32 X) with Mega-Hertz bandwidth, the VTM can eliminate bulk capacitors and the high power distribution losses caused by bussing high currents to the POL. VTMs maximize POL density and efficiency while minimizing total system cost.

The VTM V048K015T100 is rated for a maximum continuous output of 100 A up to 1.5 Vout and 150 W up to 1.6 V over a Vf input range of 26 to 55 Vdc. It can be operated either open- or closed-loop depending on the output regulation needs of the application. Operating open loop, the output voltage tracks its Vf input voltage with a transformation ratio, K=1/32, and an output resistance, R(OUT)=1.0 milliohm, to enable applications requiring a programmable low output voltage at high current and high efficiency. Closing the loop back to an input Pre-Regulator Module(TM) (PRM) or DC-DC converter compensates for R(OUT).

The 1.5V VTM achieves breakthrough current density of 400 A/cubic inch in a V-I Chip package compatible with standard pick-and-place and surface mount assembly processes. The V-I Chip BGA package supports in-board mounting with a low profile of 0.16" (4 mm) over the board. J-lead package options support on-board surface mounting with a profile as low as 0.25" (6 mm) over the board.

The VTM V048K015T100 in the V-I Chip BGA package is priced at less than 20 cents/A in OEM quantities and is available in JEDEC trays or taped and reeled for automated pick and place and SMD assembly. Prototype quantities are available now.

For a data sheet and other information on the Voltage Transformation Module, V-I Chips and Factorized Power Architecture(TM), please visit the Vicor website at www.vicorpower.com. To order, contact Vicor Express at 800-735-6200 or e-mail [e-mail].

This press release contains certain forward-looking statements as that term is defined in the Private Securities Litigation Reform Act of 1995. You can identify these statements by our use of the words "may," "will," "would," "should," "plans," "expects," "anticipates," "believes," "is designed to," "continue," "estimate," "project," "intend," and similar expressions. These forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those projected or anticipated. These risks and uncertainties include our ability to develop new products cost-effectively and our ability to decrease manufacturing costs, as well as those risks and uncertainties identified in the Company's Annual Report on Form 10-K. The risk factors contained in the Annual Report on Form 10-K may not be exhaustive. Therefore, the information contained in that Form 10-K should be read together with other reports and documents that the Company files with the SEC from time to time, which may supplement, modify, supersede or update those risk factors.

Factorized Power Architecture (FPA), Pre-Regulator Module (PRM), V-I Chip, Vicor Corporation, and Voltage Transformation Module (VTM) are trademarks of Vicor Corporation.