1-GB, 1.2-Inch-PCB-Height SDRAM DIMM From Legacy Electronics Offers High Density for Blade Server & 1U-Size Chassis Markets.Business Editors & High-Tech Writers SAN CLEMENTE, Calif.--(BUSINESS WIRE)--Sept. 10, 2002 Legacy Electronics announced a new 1-GB SDRAM (Synchronous DRAM) A type of dynamic RAM (DRAM) memory chip that has been widely used since the late 1990s. SDRAM chips eliminated wait states by dividing the chip into two cell blocks and interleaving data between them. Dual In-Line Memory Module See DIMM. (storage) Dual In-line Memory Module - Small circuit boards carrying memory integrated circuits, with signal and power pins on both sides of the board, in contrast to single-in-line memory modules (SIMM). (DIMM (Dual In-Line Memory Module) A printed circuit board that holds memory chips and plugs into a DIMM socket on the motherboard. See memory module. DIMM - Dual In-Line Memory Module ) that incorporates chip-scale FBGA-based packaging design, and meets a 1.2-inch PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. height requirement. The new DIMM, a JEDEC The division of the Electronic Industries Alliance (EIA) that deals with semiconductor standards (officially, the JEDEC Solid State Technology Association of EIA). JEDEC was formed in 1958 when the Joint Electron Tube Engineering Council (JETEC) split into two Joint Electron Device standard 128 X 72 registered Synchronous Dynamic Random Access Memory (storage) Synchronous Dynamic Random Access Memory - (SDRAM, Synchronous DRAM) A form of DRAM which adds a separate clock signal to the control signals. SDRAM chips can contain more complex state machines, allowing them to support "burst" access modes that clock out a series of (SDRAM) module, is targeted to blade-type server, limited-space designs requiring the highest density without the need for alternative types of stacking. "This new DIMM provides 1-GB density in a monolithic design," said Legacy president, Jason Engle. "This should ease some design requirements in the blade server market that, according to IDC, is expected to grow from $50 million this year to $3.7 billion by 2006." The 1-GB module incorporates Infineon Technologies' standard DRAM, and is intended for mounting in 168-pin edge connector sockets. Availability The 1-GB, 1.2-inch SDRAM DIMM is available with a 1-2 week lead time, with price discounts for volume quantities. A downloadable, four-page data sheet is available at: www.legacyelectronics.com/files/39S6JSGR-1xAG.pdf, or designers may call toll-free 888/466-3853, or e-mail: techsupport@legacyelectronics.com. About Legacy Electronics Legacy Electronics is an ISO (1) See ISO speed. (2) (International Organization for Standardization, Geneva, Switzerland, www.iso.ch) An organization that sets international standards, founded in 1946. The U.S. member body is ANSI. 9001-registered electronics firm, and home of the patented Canopy(R)(a) chip-stacking alternative technology. The company specializes in the design and manufacture of memory modules, as well as contract manufacturing services. Legacy's design and manufacturing facility incorporates the latest in surface-mount technology (SMT (1) (Surface Mount Technology) See surface mount. (2) (Station ManagemenT) An FDDI network management protocol that provides direct management. Only one node requires the software. SMT - Station Management ) and automated test (ATE) equipment. The company's newest assembly line additions include chip-scale rework and X-ray capabilities. Founded in 1993, Legacy Electronics is located among South Orange County, California's new high-technology companies. For more information, go to www.legacyelectronics.com, or call 949/498-9600. (a) Legacy Electronics' Canopy(R) technology is a patented, 3-dimensional printed circuit board subassembly process using a single-sided reflow, which increases on-board memory capacity without pre-stacking components. Considered an alternative to traditional stacking technologies, Canopy(R) reduces memory module manufacturing cost while reducing time-to-market and reliability issues, including thermal failures. Note to Editors: A downloadable jpg e-photo of Legacy Electronics' new 1.2-inch height, 1-GB SDRAM DIMM is available from http://www.legacyelectronics.com/images/39L6JSGR-xAG.jpg. |
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