"Journal of Applied Packaging Research" from DEStech publications.

DEStech Publications (Lancaster, PA), the producer of books, textbooks, CD-ROMs, proceedings and journals in advanced technology and engineering, has begun the publication of "Journal of Applied Packaging Research" with an issue in September. The new title will be published quarterly and an annual print or online subscription costs $299; $324 for both editions.

The new journal is targeted to researchers, engineers, designers and students in all areas of packaging technology, including packaging scientists and engineers, food scientists and technologists, materials scientists, mechanical engineers, industrial and systems engineers, toxicologists, chemists and regulatory officers. Content includes information on the development and application of packaging technology.

Editorial covers such topics as: fragility assessment, materials and properties, machinery and automation, RFID and tracking technology, active and intelligent packaging, packaging by industry, such as medical devices, electronics, pharmaceuticals, etc., economic models, and sterile packaging.

Besides a range of books and CD-ROMs covering such fields as advanced materials science, laser technology, plastics/ polymers and food science, DEStech also produces "Journal of Residuals Science & Technology," a quarterly that covers the scientific investigation and management of residuals in the environment.