"Effect of joint size and pad metallization on solder mechanical properties".Abstract: Metallurgical analysis, mechanical testing and finite element analysis Finite element analysis (FEA) is a computer simulation technique used in engineering analysis. It uses a numerical technique called the finite element method (FEM). There are many finite element software packages, both free and proprietary. were conducted to understand the effect of joint size and pad metallization Met`al`li`za´tion n. 1. The act or process of metallizing. on solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i. behavior. A range of design and material variables was evaluated. The pad metallization affected both the intermetallic compounds Intermetallic compounds Materials composed of two or more types of metal atoms, which exist as homogeneous, composite substances and differ discontinuously in structure from that of the constituent metals. They are also called, preferably, intermetallic phases. at the joint interfaces and those dispersed in the bulk solder. NiAu pad metallization resulted in more creep-resistant joints than did copper. These effects were more pronounced at lower test temperatures. Solder joint creep resistance increased with joint size. Larger joints also were more prone to brittle interface failure than smaller joints. This was true in package-and board-level tests. Finite element analysis indicated the test vehicle used to generate data for constitutive constitutive /con·sti·tu·tive/ (kon-stich´u-tiv) produced constantly or in fixed amounts, regardless of environmental conditions or demand. constants significantly affect the predicted fatigue life in cyclic drop or temperature cycle testing. More creep-resistant behavior resulted in lower strain and work for both temperature cycle and drop test conditions. When comparing strain vs. work as a damage indicator, it is seen that work is less sensitive to variations in the constitutive constants. (Electronic Components & Technology Conference, May 2008) Authors: Robert Darveaux, Corey Reichman, C.J. Berry, Wen-Sung Hsu, Ahmer Syed, Chang Woo Kim, Jung Hun Ri, Tae Seong Kim; rdarv@amkor.com. |
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